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CS551|3.5" SBC|8th/9th Intel®|Intel Pentium® or Celeron®|DFI

CS551
Industrial Motherboards 3.5" SBC CS551
  • 9th/8th Gen Intel® Core™ with Intel® C246
  • 1 DDR4 SODIMM up to 32GB
  • Three independent displays: LVDS + DP++ + DP++
  • DP++ resolution up to 4096x2304 @ 60Hz
  • Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
  • Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1' 35 (Based on Intel IOTG Roadmap)

Status : Launched

Fanless Design
4K2K Display
Mini PCIe
DDR4
Triple Independent Display
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RoHS Certification
CE Certification
FCC Certification
UKCA Certification

CS551 Related Tags

#IoT#Intel#Mini PCIe#Fanless Design#4K2K Display#Windows#Linux#DP#DDR4#CPU Auto Warm-up
CS551
CS551
CS551
CS551
System
Processor
8th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)
Memory
One 260-pin SODIMM up to 32GB
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900T
BIOS
Insyde SPI 128Mbit
Graphics
Controller
Intel® UHD 630 Graphics GT Series
Feature
OpenGL 4.6, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
Display
1 x LVDS
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304
Triple Displays
LVDS + DP++ + DP++
Expansion
Interface
1 x Full-size Mini PCIe (PCIe x1 up to Gen3/USB 2.0) (C246/Q370 opt.: USB 3.1 Gen1/USB 2.0)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)
Audio
Audio Codec
Realtek ALC262
Ethernet
Controller
Intel® I211AT PCIe (10/100/1000Mbps) or Intel® I210IT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
USB
4 x USB 3.1 Gen2 (C246/Q370) or Gen1 (H310)
Display
2 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x LVDS Backlight
Audio
1 x Audio (Line-out/Mic-in)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Heater
1 x 12V header (wide temp. only)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM 2.0
Power
Type
12VDC
Connector
Vertical Type Connector (4-pin) (default)
DC Jack (available upon request)
Consumption
Typical: i7-8700T: 12V @ 0.86A (10.32Watt)
Max: i7-8700T: 12V @ 5.38A (64.56Watt)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit RS5
Linux
Linux
Environment
Temperature
Operating:
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
*Note: A heater/polyfilm is recommended for motherboard warm up at -30°C.
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
CS551-H310-BCA: 740,203 hrs @ 25°C; 462,070 hrs @ 45°C; 305,215 hrs @ 60°C; 227,949 hrs @ 70°C
CS551-H310-ECA: 742,388 hrs @ 25°C; 464,078 hrs @ 45°C; 3067,73 hrs @ 60°C; 229,188 hrs @ 70°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled
Mechanism
Dimensions
3.5" SBC Form Factor
146mm (5.75") x 102mm (4.02")
Height
PCB: 1.6mm
Top Side: 25.27mm, Bottom Side: 7.68 mm
Packing List
Packing List
1 CS551 board
1 COM port cable (Length: 250mm, 1 x COM port) 332-753040-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 Serial ATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink (Height: 43.2mm) A71-001302-030G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    CS551-C246-BCA
    Part Number :
    770-CS5511-000G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C
  • Model Name :
    CS551-H310-BCA
    Part Number :
    770-CS5511-100G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -5 to 65°C
  • Model Name :
    CS551-Q370-BCA
    Part Number :
    770-CS5511-200G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C
  • Model Name :
    CS551-C246-ECA
    Part Number :
    770-CS5511-300G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C
  • Model Name :
    CS551-H310-ECA
    Part Number :
    770-CS5511-400G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -30 to 80°C
  • Model Name :
    CS551-Q370-ECA
    Part Number :
    770-CS5511-500G
    Description :
    1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    USB port cable
    Part Number :
    A81-001032-016G
    Description :
    Length: 200mm
  • Item Name :
    Power adapter
    Part Number :
    671-110006-100G
    671-106012-000G
    Description :
    100W, 12V, TDP 35W
    60W, 12V, DC Jack, TDP 15W
  • Item Name :
    4 pin to DC jack cable
    Part Number :
    A81-004051-016G
    Description :
    Length: 100mm
  • Item Name :
    Audio cable
    Part Number :
    A81-022007-016G
    Description :
    Length: 160mm
  • Item Name :
    Cooler fan
    Part Number :
    A71-101303-010G
    Description :
    Height: 34.6mm
  • Item Name :
    Heater
    Part Number :
    612-KP4040-000G
    Description :

World’s First! 3.5” SBC Desktop Platform with Auto Warm-up

The CS551 is the world’s first compact-sized AI motherboard with auto warm-up function for processor to withstand the extreme cold weather at -30°C. The 3.5" SBC is powered by robust 8th Gen Intel Core i processors that support dynamic performance adjustment of CPU and GPU, high-speed image analysis and transmission, while obtaining all the expansion interfaces required for edge AI computing. The CS551 will bring a brand-new experience with smart edge computing and make your solution a pioneer as well!

Smart Adjustment Of CPU/GPU

The CS551 breaks through the limitation of operating temperature up to 60°C supported by the processors, and extends it up to 80°C based on the desktop platform. When the workload of the processors reach a critical point, the CPU and GPU dynamically and intelligently adjust the resources for smooth computing rather than crashing due to overheating. That stabilizes the overall processing speed and achieves the best balance of performance, endurance, and heat dissipation, ensuring stable operation in high temperature regions for oil exploration, AI vision analysis and high density computing in power plant automation.

Challenge Extreme Weather Down to -30°C

Unlike ordinary desktop platforms, the CS551 is the first to use automatic warm-up to extend the operating limit of the processor down to -30°C. It easily solves the long-standing problems of damage and constraint on the automation equipment caused by the sudden extreme weather change events, and ensures the outdoor computing applications, such as traffic flow analysis, or unmanned transportation vehicles and robotic arms in cold warehouses, to operate stably even at extremely low temperatures.

2X Expansion

Unlike other 3.5" SBCs on the market with only M.2 2242 expansion support, the CS551 upgrades the expansion space to M.2 2280 size. A larger space means not only the compatibility with the M.2 2280 size only modules, but also more than 2 times increase of the storage space and I/O interfaces to support more applications.

Fanless/Fan Dual Cooling Support @80°C

Desktop platforms normally only support the operating environment up to 60°C, which usually use a cooler with fan for heat dissipation. Differently, the CS551 extends the operating temperature, and even provides another option with extended lifespan of the device – the fanless cooling system. With the heat sink, the heat generated by the processors while computing can be effectively dissipate, and ensures the outdoor smart devices (e.g., traffic analysis devices, smart stations…etc.) to run stably when exposed to direct sunlight during summer and heat waves.

High-Speed Data R/W With ECC Support

In addition to the powerful CPU, the CS551 is also designed with DDR4 RAM supporting up to 2666MHz 32GB high-speed reading/writing for smoother and more stable image analysis performance. The Intel C246 chipset further supports server-grade ECC function to automatically correct memory errors and prevent crashes, ensuring the correctness and completeness of the large scale of data in applications.

Fantastic Visual Performance

DFI’s completed product series with Intel 8th gen processors have the capability of delivering advanced 4K video experiences supported with resolution higher than 1080p and high quality UHD streaming media for applications such as digital signage, digital security, and surveillance.

Enhanced Security Protection

For defending equipment from external threats of security awareness, DFI’s motherboards are available with the advanced feature of iAMT 12.0 for remote management and repair of systems. Aside from iAMT 12.0, DFI’s motherboards are supported with TPM 2.0 for protecting confidential data and improving system integrations.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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