High Performance AMD Ryzen™ R2000 Processor-PCSF51
Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.
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COM Express Mini module delivers high performance on a small footprint, which features a 55 x 84 mm size. It is ideal for space-limited, power-saving, and mobile applications. DFI's ultra-small modules are available with COM Express pin-out Type 10.
COM Express Compact module is designed with computing capability and cost efficiency in a compact form factor with a footprint of 95 x 95 mm, making it the best option for transportation and defense applications. DFI's Compact modules are available with COM Express pin-out Type 2 and Type 6.
COM Express Basic module provides high-level processing performance and high-speed interfaces for a wide range of computing-demand applications such as medical and industrial automation. DFI's Basic modules are compatible with COM Express pin-out Type 2, Type 6, and Type 7.
Qseven is equipped with fast serial interfaces in an ultra-small form factor with a measurement of just 70 x 70 mm. It is much smaller than other system-on-modules, which makes it an ideal solution for space-limited and low power applications.
DFI’s carrier board (also known as base board or evaluation board) offers a flexible engineering development environment for COM Express Type 10, Type 7, Type 6, Type 2, and Qseven. Which helps our customers minimize integration requirements while reducing development time and cost.
Intel® Smart Display Module is for next generation commercial AIO displays and visual IoT devices. Intel® SDM provides the primary compute building block and requires an interface board on the displays or host system to complete platform implementation and provide standard end user physical interfaces.