Would you answer a brief survey?

Thank you for taking this survey. Your feedback will help us improve our official website and provide a better user experience.

Your feedback has been successfully submitted. Thank you very much for your time and participation.

Close

RPS9HC-R680E/Q670E/H610E|Intel®|System-On-Modules|DFI

RPS9HC-R680E/Q670E/H610E
Home System-On-Modules COM HPC RPS9HC-R680E/Q670E/H610E
  • 13th Gen Intel® Core™ with Intel® R680E/Q670E/H610E Chipset
  • 4 DDR5 SODIMM 3600MHz up to 128GB
  • Quad Displays: eDP + 3 DDI
  • DDI supports up to 8K
  • Multiple Expansion: 1 PCIe x16 (Gen5), 4 PCIe x4 (Gen4), 2 PCIe x4 (Gen3), 2 PCIe x1 (Gen3)
  • Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

Status : Preliminary QUOTE NOW

Multiple Expansion
Quad Independent Display
DDR5
Rich I/O
10 Years CPU Life Cycle Support
8K resolution
Product Comparison
You have items. ,Up to 3 items.
COMPARE NOW
Quotation
You have ,Up to 3 items.
QUOTE NOW
RoHS Certification
CE Certification
FCC Certification

RPS9HC-R680E/Q670E/H610E Related Tags

#8K resolution#DDR5#13th Gen Intel® Core™ Processor#eDP#Slim Bootloader(Upon Request)#IoT#Intel#PCIe x16#Windows#Linux#HDMI#DP#RoHS Certification#CE Certification#FCC Certification#2.5G Ethernet
RPS9HC-R680E/Q670E/H610E|Intel®|System-On-Modules|DFI
RPS9HC-R680E/Q670E/H610E|Intel®|System-On-Modules|DFI
RPS9HC-R680E/Q670E/H610E|Intel®|System-On-Modules|DFI
System
Processor
13th Gen Intel® Core™ Processors, LGA 1700 Socket Processors, TDP support up to 65W
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W
Chipset
Intel® R680E/Q670E/H610E Chipset
Memory
4pcs DDR5 SO-DIMM up to 128GB
Dual Channel DDR5
ECC support by R680 with i7 and i5
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® HD Gen 9 Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
3 x DDI (HDMI/DP++) support to 8K
1 x eDP support to 5K
Quad Displays
eDP + 3 DDI
Expansion
Interface
1 x PCIe x16 (Gen5)
4 x PCIe x4 (Gen4)
2 x PCIe x4 (Gen3)
2 x PCIe x1 (Gen3)
1 x eSPI
1 x I2C
1 x SMBus
2 x UART (TX/RX/RTS/CTS)
Audio
Audio Codec
HD Audio
Ethernet
PHY
2 x Intel® I226 series (10/100/1000Mbps/2.5G)
I/O
USB
4 x USB 3.2 Gen2
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
GPIO
12 bit in/out
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
TPM2.0 (Available Upon Request)
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 20.04
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM HPC® Client Size C
6.30" x 4.72" (160mm x 120mm)
Compliance
PICMG COM HPC® R1.15, Client Size C
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
• COM836 carrier board kit, 770-COM8361-000G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    RPS9HC-R680E-BS-13900E
    Part Number :
    770-RPS9HC1-000G
    Description :
    Intel® Core™ i9-13900E, R680E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C
  • Model Name :
    RPS9HC-Q670E-BS-13700E
    Part Number :
    770-RPS9HC1-100G
    Description :
    Intel® Core™ i7-13700E, Q670E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C
  • Model Name :
    RPS9HC-H610E-BS-13100E
    Part Number :
    770-RPS9HC1-200G
    Description :
    Intel® Core™ i3-13100E, H610E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started