DFI, a leading provider of embedded x86 products, today announces a new desktop microATX industrial motherboard, the SB332-C, which supports 10 Serial COM ports. This microATX form factor board supports the 3rd/2nd Gen Intel® Core™ i7, i5 and i3 processors that feature 32/22-nanometer process technology with the cost-effective Intel® H61 chipset. These processors provide higher performance at lower power than previous processors. The SB332-C microATX industrial motherboard also supports the economical Intel® Pentium™ processors, G850 and i3-2120, for cost sensitive applications.
The Intel® HD Graphics 2000 engine integrated into these scalable desktops' 2nd and 3rd generation Intel® Core™ processors supports six Graphics Execution Units (EUs). The Intel® Clear Video Technology provides advanced imaging capability for DirectX Video Acceleration (DXVA) to accelerate video processing speed. HDMI and VGA graphics interface connectors provide dual independent displays. HDMI display supports up to 1920 x 1200 pixels and VGA display supports up to 2048 x 1536 pixels with 32-bit color at 75Hz resolution.
This scalable desktop platform supports up to 16GB DDR3 1066/1333/1600MHz system memory, 2-channel HD audio with S/PDIF input/output interface, and 2 Gigabit LAN controllers for increased transmission speed. The Intel® H61 Express chipset used on this microATX motherboard delivers high performance I/O. It comes with 4 Serial ATA 2.0 ports with data transfer rate up to 3Gb/s, 10 USB 2.0 ports, 10 Serial COM ports, 1 parallel port, and 8-bit digital I/O connector for device controls. The expansion design of this platform supports 1 PCIe x16 slot, 1 PCIe x4 slot and 2 PCI slots to offer additional expansion capability.
In addition, this new platform supports Intel® Hyper-Threading and improved Intel® Turbo Boost Technology, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides increased performance over the previous generation platform for both multi-core and non-multi-core optimized application programs. The combination of Intel® Hyper-Threading, Intel® Turbo Boost improvements, and the new three-level cache subsystem ensures higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.
These features make the SB332-C motherboard ideal for intensive applications, such as ATM/POS machines, industrial control automation, and digital signage use.
• microATX form factor (244mm x 244mm)
• 3rd/2nd Gen Intel® Core™ i7/i5/i3 processors
• Intel® H61 Express Chipset
• Up to 16GB DDR3 1066/1333/1600MHz dual-channel memory
• HDMI and VGA interfaces supporting dual independent displays
• 2 Intel® Gigabit LAN controllers
• 10 Serial COM ports
- 1 RS232/422/485
- 1 RS232
- 8 external RS232 serial ports
• 10 USB 2.0 ports
• 4 serial ATA interfaces (3Gb/s)
• 8-bit Digital I/O connector
• 1 parallel port
• HD audio support via S/PDIF input/output
• 1 PCIe x16 slot
1 PCIe x4 slot
2 PCI slots
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an e-mail: firstname.lastname@example.org
For more information on the SB332-C microATX Industrial Motherboard, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.