DFI today launches SB102-D, a new Mini-ITX motherboard in its cost-reduced Intel® H61 product line. It features the 2nd Gen Intel® Core processor family paired with the Intel® H61 Express chipset. From the dual-core i3 processor to the quad-core i7 processor, SB102-D is cross compatible with the new 3rd Gen Intel® Core™ processors. And with the 3rd Gen processors built on 22-nanometer process technology, this cost-effective board is powerful and yet energy-efficient.
The Intel® HD Graphics 2000 engine integrated into the scalable desktop processor supports six graphics execution units with dynamic turbo boost to accelerate video processing, and Intel® Clear Video Technology providing advanced imaging capability for Blu Ray and other high definition video processing. Performance is further increased through the introduction of Intel® Advanced Vector Extensions (AVX) to the instruction set, providing acceleration of complex audio, video, and image processing. HDMI and DVI graphics interface connectors provide dual independent display support up to 1,920 x 1,200 @ 60Hz resolution. An optional SDVO-LVDS daughterboard supports LVDS display up to 1,600 x 1,200 resolution and dimming control via hot keys.
In addition, this new platform supports Intel® Hyper-Threading and improved Intel® Turbo Boost Technology, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides increased performance over the previous generation platform for both multi-core and non-multi-core optimized application programs. The combination of Intel® Hyper-Threading, Intel® Turbo Boost improvements, and the new three-level cache subsystem insures higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.
This scalable desktop platform supports up to 16GB DDR3 SODIMM memory, 5.1-channel HD audio with audio amplifier interface, and 2 Intel® Gigabit LAN for increased transmission speed. The Intel® H61 Express chipset used on this Mini-ITX embedded board delivers high performance I/O. It provides 4 Serial ATA 2.0 ports with speed up to 3Gb/s, 8 USB 2.0 ports, 2 Serial COM ports, and 8 digital I/O ports for device controls.
The SB102-D offers additional expansion capability via a PCIe x16 expansion slot, and a Mini PCIe slot that accommodates half size card.
These features make the SB102-D ideal for intensive applications such as gaming machine, industrial control automation, medical equipment, telecom, and transportation.
• Mini-ITX form factor (170mm x 170mm)
• Supports 3rd/2nd Gen Intel® Core™ processors
• Intel® H61 Express Chipset
• Up to 16GB DDR3 SODIMM, dual-channel memory
• HDMI and DVI interfaces supporting dual independent displays
• 2 Intel® Gigabit LAN controllers
• 2 Serial COM ports
• 8 USB 2.0 ports
• 4 SATA 2.0 (3Gb/s)
• 8-bit Digital I/O
• 5.1-channel HD audio
• 1 PCIe x16 slot
1 Mini PCIe slot
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: firstname.lastname@example.org
For more information on the SB102-D embedded Mini-ITX board, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 31 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI® uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI® works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.