DFI today launches 2 new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel® Core™ processors. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. The boards support the quad-core Intel® Core™ i7-3610QE and the dual-core Intel® Core™ i5-3610ME processors. These processors offer higher performance at lower power consumption than the 2nd generation Intel® Core™ processors which are also supported on these module boards.
The low power module boards take full advantage of the mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.
The Intel® HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. Targeted at multimedia and medical applications, CR901-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, DisplayPort, and SDVO) allowing you to choose the best combination to suit various applications requirements. CR900-B on the other hand supports VGA and LVDS interfaces for dual independent display with resolution up to 1920x1200 @ 60Hz.
The module boards support the same high performance I/O expansion except for CR901-B which supports the new USB 3.0 that is capable of processing more data load.
The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.
All product specifications are subject to change without notice.
Intel® and Intel® Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
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For more information on the CR901-B and CR900-B COM Express boards, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 30 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI® uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI® works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.