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AL9A2

System-On-Modules COM Express Mini AL9A2
  • Intel Atom® E3900 Processor Series
  • Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
  • Multiple expansions: 4 PCIe x1
  • 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP
  • Dual Channel DDR3L 1600MHz Memory Down up to 8GB
  • 15-Year CPU Life Cycle Support

Status : Preliminary

Wide-temp: -40°C~85°C
Fanless Design
Compact Size
4K2K Display
Multiple Expansion
Product Comparison
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COM Express Type 10, AL9A2
COM Express Type 10, AL9A2
System
Processor
Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory
4GB/8GB DDR3L Memory Down (ECC support only for 8GB)
Single Channel DDR3L 1600MHz
BIOS
AMI SPI 128Mbit (supports UEFI boot only)
Graphics
Controller
Intel® HD Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DVI/DP)
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz
HDMI: resolution up to 3840 x 2160 @ 30Hz
DP++: resolution up to 4096x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Displays
DDI + LVDS
DDI + eDP
Expansion
Interface
4 x PCIe x1 (Gen 2)
1 x SDIO (available upon request)
1 x LPC
2 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I210AT (10/100/1000Mbps) (0°C to 60°C)
1 x Intel® I210IT (10/100/1000Mbps) (-40°C to 85°C)
I/O
USB
2 x USB 3.0
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
eMMC
1 x 8GB/16GB/32GB/64GB eMMC (available upon request)
GPIO
1 x 8-bit GPIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
OS Support (UEFI Only)
Windows: Windows 10 IoT Enterprise 64-bit
Linux: Ubuntu 15.10 (Intel® graphic driver available)
Environment
Temperature
Operating: 0 to 60°C
-40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM Express® Mini 84mm (3.30") x 55mm (2.16")
Compliance
PICMG COM Express® R2.1, Type 10
Packing List
Packing List
1 AL9A2 board
1 Heat sink: TBD
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    AL9A2-BT
    Part Number :
    TBD
    Description :
    Fanless, Intel Pentium N4200, 1 LVDS, 1 SDIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, 16GB eMMC, -40 to 85°C
  • Model Name :
    AL9A2-TS
    Part Number :
    TBD
    Description :
    Fanless, Intel Atom x5-E3930, 1 LVDS, 1 SDIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, 16GB eMMC, 0 to 60°C
  • Model Name :
    AL9A2-BS
    Part Number :
    TBD
    Description :
    Fanless, Intel Atom x7-E3950, 1 eDP, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L ECC Memory Down, 16GB eMMC, 0 to 60°C
  • Model Name :
    AL9A2-TS
    Part Number :
    TBD
    Description :
    Fanless, Intel Atom x5-E3940, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L ECC Memory Down, 16GB eMMC, 0 to 60°C

* N4200 and N3350 are supported upon request with MOQ requirement

Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat spreader
    Part Number :
    TBD
    Description :
  • Item Name :
    COM100-B carrier board kit
    Part Number :
    770-COM102-000G
    Description :

Rugged Design and Energy-Efficiency for Deeply Embedded Applications

DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.

Wide Operating Temperature with Fanless Design

These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.

Energy Saving but High Performance

With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.

Experience Clarity with 4K UHD High-Resolution

The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for medical and multimedia solution.

Multiple Storage Choice: eMMC, SSD/ M.2 Module

As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB. Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice for automation, storage and design of IoT appliances.

Complete Product Line

Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1.

Endless IoT Possibilities with Windows 10 Compatibility

Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution.