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CS100

Industrial Motherboards Mini-ITX CS100
  • 8th Gen Intel® Core™ with Intel® Q370/C246/H310
  • 2 DDR4 2400/2666MHz SODIMM up to 32GB
  • Three independent display: LVDS+VGA+DP++, LVDS+DP++ +DP++, VGA+ DP++ +DP++
  • Multiple Expansions: 1 PCIe x16 (Gen 3), 1 Full-size Mini PCIe (Q370/C246); 1 PCIe x16 (Gen 3), 1 mSATA (H310)
  • Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.1 Gen 2, 2 USB 3.1 Gen 1, 4 USB 2.0 (Q370/C246); 2 Intel GbE, 2 COM, 4 USB 3.1 Gen 1, 4 USB 2.0 (H310)
  • 15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

Status : Launched

COM ESD Protection: Air Gap ±15kv
Fanless Design
4K2K Display
Windows
DDR4
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CS100
CS100
CS100
System
Processor
9th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 35W
Intel® Core i7-9700TE Processor
Intel® Core i5-9500E Processor
Intel® Core i5-9500TE Processor
Intel® Core i3-9100E Processor
Intel® Core i3-9100TE Processor
8th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 80W
Intel® Xeon E-2176G Processor (support ECC Memory)
Intel® Core™ i7-8700 Processor
Intel® Core™ i5-8500 Processor
Intel® Core™ i3-8100 Processor (support ECC Memory)
Intel® Pentium G5400 Processor (support ECC Memory)
Intel® Celeron G4900 Processor (support ECC Memory)
Chipset
Intel® Q370/C246/H310 Chipset
Memory
Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 2400/2666MHz (C246 supoort ECC)
BIOS
AMI SPI 128Mbit
Graphics
Controller
Intel® UHD Graphics 630 (Pentium G5400, Celeron G4900 support Intel® UHD Graphics 610)
Feature
OpenGL 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
1 x LVDS
1 x VGA
2 x DP++
LVDS: resolution up to 1920x1200 @ 60Hz
VGA: resolution up to 1920x1200 @ 60Hz
DP: resolution up to 4096x2304 @ 60Hz
Triple Displays
LVDS+VGA+DP++, LVDS+DP++ +DP++, VGA+ DP++ +DP++
Expansion
Interface
Q370/C246:
1 x PCIe x16 (Gen 3)
1 x Full-size Mini PCIe (& mSATA)

H310:
1 x PCIe x16 (Gen 3)
1 x mSATA
Audio
Audio Codec
Realtek ALC888S-VD2-GR
Ethernet
Controller
C246/Q370: 1 x Intel® I219LM PHY, 1 x Intel® I211AT PCIe (10/100/1000Mbps) (only Core i7/i5 support iAMT)
H310: 1 x Intel® I219V PHY, 1 x Intel® I211AT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
Serial
1 x RS-232 (DB-9)
USB
Q370/C246:
2 x USB 3.1 Gen2
2 x USB 3.1 Gen1
4 x USB 2.0

H310:
4 x USB 3.1 Gen1
4 x USB 2.0
Display
1 x VGA
2 x DP++
Audio
1 x Line-in (available upon request)
1 x Line-out
1 x Mic-in
Internal I/O
Serial
1 x RS-232 (RS-232 w/ power)(2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
Audio
1 x S/PDIF
1 x Front Audio
SATA
3 x SATA 3.0 (up to 6Gb/s)

DIO
1 x 8-bit DIO
LPC
1 x LPC (support LPC EXT-RS232/RS485 module)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM2.0 (available upon request)
Power
Type
ATX
Connector
4-pin ATX 12V power
24-pin ATX power
Consumption
Idle: i7-8700 65W: 12V @ 0.39A (4.68W), 5V @ 0.53A (2.65W), 3.3V @ 0.23A (0.795W)
Max: i7-8700 65W: 12V @ 11.24A (134.88W), 5V @ 1.14A (5.7W), 3.3V @ 0.25A (0.825W)
Battery
CR2032 Coin Cell
OS Support
OS Support
Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
CS100-C246: 639,615 hrs @ 25°C; 393,053 hrs @ 45°C ; 259,094 hrs @ 60°C
CS100-Q370: 639,615 hrs @ 25°C; 393,053 hrs @ 45°C ; 259,094 hrs @ 60°C
CS100-H310: 640,703 hrs @ 25°C; 393,874 hrs @ 45°C ; 259,692 hrs @ 60°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
Height
PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
Standards and Certifications
Certifications
CE, FCC Class B, RoHS
Packing List
Packing List
1 CS100 motherboard
1 COM port cable (Length: 250mm, 1 x COM ports) A81-015011-001G
1 I/O shield A49-CS1000-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    CS100-H310D
    Part Number :
    770-CS1001-000G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
  • Model Name :
    CS100-Q370D
    Part Number :
    770-CS1001-100G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
  • Model Name :
    CS100-C246D
    Part Number :
    770-CS1001-200G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
  • Model Name :
    CS100-H310D
    Part Number :
    770-CS1001-300G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
  • Model Name :
    CS100-Q370DRM
    Part Number :
    CS100-770-CS1001-400G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
  • Model Name :
    CS100-C246DRM
    Part Number :
    770-CS1001-500G
    Description :
    Cooler, 2 DDR4 SODIMM, 1 LVDS, 1 VGA, 2 LAN, 2 COM, 8 USB, 0 to 60°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    USB port cable
    Part Number :
    A81-001032-016G
    Description :
    Length: 200mm
  • Item Name :
    COM port cable
    Part Number :
    A81-015011-001G
    Description :
    Length: 250mm, 1 x COM ports
  • Item Name :
    Serial ATA data with power cable
    Part Number :
    332-553001-005G
    Description :
    Length: 500mm
  • Item Name :
    Thermal solution
    Part Number :
    A71-103004-000G
    Description :
    For 35W, Height: 37.3mm
  • Item Name :
    Thermal solution
    Part Number :
    552-200049-000G
    Description :
    For 65W, Height: 72.8mm
  • Item Name :
    LPC EXT-RS232 module
    Part Number :
    770-EXTRS1-000G
    Description :
    4 x RS232 ports
  • Item Name :
    LPC EXT-RS485 module
    Part Number :
    770-EXTRS1-100G
    Description :
    4 x RS485 ports

Based on 8th Gen Intel® Core™ Processors

DFI’s brand new board series with 8th Generation Intel® Core™ processors are ideally designed for what’s coming in the new era. We have a full form factor lineup from Mini-ITX, micro-ATX, ATX, to SOM integrated with better CPU performance support with up to 6 processor cores increasing 10% performance than previous generation even when multitasking.

Complete Product Line

DFI offers a complete product series from different form factor motherboards like ATX, microATX, Mini-ITX, and system-on-modules based on 8th Generation Intel® Core™ Processor Family with high-performance design. It is able to be perfectly fitted into different applications.

Optimized Productivity & Responsiveness

DFI’s product series are supported with Intel® Optane™ memory to accelerate computer’s responsiveness to multitask workloads without wasting too much time. Additionally, our products support with 64 GB DDR4 RAM memory up to 2666 MHz to enhance better memory bandwidth and memory transfer speeds. DFI’s motherboard comes with an M.2 (2280) to support NVMe drives with write speeds up to 3500MB/s which are 7 times over SATA SSDs.

Improved and Multiple I/O Options

Our product series with 8th gen processors adopt the newest technology USB Type-C and USB 3.1 Gen2 to benefit data transfer rates of up to 10 Gbps. It’s two times faster than USB 3.0. Furthermore, our ATX motherboard series come with Intel Q370 chipset and 24 PCIe lanes, which have 4 more PCIe lanes than the Intel Q170 chipset motherboard. This enables rich I/Os and multiple expansions, making it an ideal solution for machine vision and industrial automation application.

Fantastic Visual Performance

DFI’s completed product series with Intel 8th gen processors have the capability of delivering advanced 4K video experiences supported with resolution higher than 1080p and high quality UHD streaming media for applications such as digital signage, digital security, and surveillance.

Enhanced Security Protection

For defending equipment from external threats of security awareness, DFI’s motherboards are available with the advanced feature of iAMT 12.0 for remote management and repair of systems. Aside from iAMT 12.0, DFI’s motherboards are supported with TPM 2.0 for protecting confidential data and improving system integrations.