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KD331-Q170|Intel®|Industrial Motherboards|DFI

KD331-Q170
Home Industrial Motherboards microATX KD331-Q170
  • 6th/7th Gen Intel® Core™ with Intel® Q170
  • 4 DDR4 DIMM up to 64GB
  • Three independent displays: VGA + DVI-I + DP++
  • Multiple expansion: 2 PCIe x16 (1 x16 or 2 x8 signal), 2 PCIe x4, 1 M.2, 1 LPC
  • Rich I/O: 4 Intel GbE, 6 COM, 6 USB 3.0, 6 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

Status : Launched BUY ONLINE (US)

COM ESD Protection: Air Gap ±15kv
Wide-temp: -40°C~85°C
DP
Multiple Expansion
DDR4
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RoHS Certification
UL Certification
CE Certification
FCC Certification

KD331-Q170 Related Tags

#Intel#PCIe x16#Windows#Linux#DVI-I#DVI-D#VGA#DP#Multiple Expansion#DDR4#RoHS Certification#UL Certification#CE Certification#FCC Certification
microATX Board Front
microATX Board I/O
microATX Board Side
System
Processor
6th/7th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors with TDP up to 95W
Chipset
Intel® Q170 Chipset
Memory
Four 288-pin DIMM up to 64GB Dual Channel DDR4 2133/2400 MHz
BIOS
Insyde SPI 128Mbit
Graphics
Controller
Intel® HD Gen 9 Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA
1 x DVI-I (DVI-I-D signal)
1 x DP++
VGA: resolution up to 1920x1200 @ 60Hz
DVI-I: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2106 @ 60Hz
Triple Displays
VGA + DVI-I (DVI-D signal) + DP++
Expansion
Interface
2 x PCIe x16 (1 x16 or 2 x8 signal) (Gen 3)
2 x PCIe x4 (Gen 3)
1 x M.2 2260/2280 M key (SATA3.0/PCIe Gen3 x2 NVMe) (2260/2280)
Audio
Audio Codec
Realtek ALC888S-VD2-GR
Ethernet
Controller
3 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM PCIe (10/100/1000Mbps) (only CoreTM i7/i5 supports iAMT)
Rear I/O
Ethernet
4 x GbE (RJ-45)
Serial
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
USB
4 x USB 3.0
2 x USB 2.0
PS/2
1 x PS/2 (mini-DIN-6)
Display
1 x VGA
1 x DVI-I (DVI-D signal)
1 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)
USB
2 x USB 3.0 (2.00mm pitch)
4 x USB 2.0 (2.54mm pitch) or 2 x USB2.0 (2.54mm pitch) +1 x Vertical USB 2.0 (opt.)
Audio
1 x Front Audio Header
1 x S/PDIF
SATA
5 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10
DIO
1 x 8-bit DIO
LPC
1 x LPC (supports LPC EXT-RS232/RS485 module)
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
Infineon TPM2.0/1.2 (opt., MOQ required)
Power
Type
ATX
Connector
8-pin ATX 12V power 24-pin ATX power
Consumption
Typical: i7-7700: 3.3V @ 0.4817A (1.58961W); 5V @ 0.5781A (2.8905W); 12V @ 0.3707A (4.4484W)
Max.: i7-7700:3.3V @ 0.476A (1.5708W); 5V @ 0.6863A (3.4315W); 12V @ 9.2347A (110.816W)
RTC Battery
CR2032 Coin Cell
OS Support
OS Support
Windows 7 32/64-bit
Window 8.1 64-bit
Windows 10 64-bit
Linux
Note: 7th Gen CPU SKU ONLY support Windows 10 64-bit & Linux.
Environment
Temperature
Operating: 0 to 60°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
Humidity
Operating: 5 to 90% RH Storage: 5 to 90% RH
MTBF
503,212hrs @ 25°C; 281,329hrs @ 45°C ; 175,239hrs @ 60°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled
Mechanism
Dimensions
microATX form factor 244mm (9.6") x 244mm (9.6")
Height
PCB: 1.6mm
Top Side: 38.5mm
Bottom Side: 4.4mm
Standards and Certifications
Certifications
CE, FCC, RoHS, UL
Packing List
Packing List
1 KD331-Q170 motherboard
1 COM port cables (Length: 300mm, 2 x COM ports) A81-015026-023G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 I/O shield A49-KD3310-000G
1 M.2 standoff A33-725019-090G
1 M.2 screw for 2260 A32-112016-041G
1 M.2 screw for 2280 A32-113016-050G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    KD331-Q170IRM
    Part Number :
    770-KD3315-000G
    Description :
    4 DDR4 DIMM, 4 LAN, 6 COM, 12 USB, 0 to 60°C
  • Model Name :
    KD331-Q170IRM
    Part Number :
    770-KD3315-200G
    Description :
    4 DDR4 DIMM, 4 LAN, 6 COM, 12 USB, 1 TPM 2.0, 0 to 60°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    USB 2.0 port cable
    Part Number :
    A81-001066-016G
    Description :
    Length: 350mm
  • Item Name :
    USB 3.0 port cable
    Part Number :
    A81-001052-023G
    Description :
    Length: 320mm
  • Item Name :
    D-SUB cable
    Part Number :
    A81-015026-023G
    Description :
    w/Bracket, Length: 300mm, 2 x DB9
  • Item Name :
    Serial ATA data cable
    Part Number :
    332-553001-005G
    Description :
    w/Lock, Length: 500mm
  • Item Name :
    Thermal solution
    Part Number :
    A71-103004-000G
    A71-101158-000G
    761-103001-000G
    Description :
    For 35W, Height: 37.3mm
    For 65W, Height: 74.47mm
    For 95W, Height: 77.2mm
  • Item Name :
    LPC EXT-RS232 module
    Part Number :
    770-EXTRS1-000G
    Description :
    4 x RS232 ports
  • Item Name :
    LPC EXT-RS485 module
    Part Number :
    770-EXTRS1-100G
    Description :
    4 x RS485 ports
  • Item Name :
    DP to HDMI Dongle
    Part Number :
    612-D2H13M-000G
    Description :

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Complete Industrial Motherboard Product Line

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Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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