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X6-MTH|Intel®|Industrial Computers|DFI

X6-MTH
Home Industrial Computers AI Inference/Training System X6-MTH
  • Intel® Core™ Ultra 5/7 Processor (Meteor Lake: U/H-series)
  • Dual Channel DDR5 5600MHz SODIMM up to 64GB
  • Supports 2 GbE, 2 USB 3.2, 2 USB 2.0, 1 RS232/422/485/ CAN bus/ GPIO port
  • Multiple Expansions: 3 B, M, E key M.2 slots
  • Support DFI defined Out of band management
  • Up to 32 TOPS of AI performance

Status : Preliminary QUOTE NOW

Wide Voltage: 9~36V DC-in
4K2K Display
Multiple Expansion
DDR5
AI
Out-of-band (OOB)
Product Comparison
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Quotation
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RoHS Certification
CE Certification
FCC Certification
UL-US Certification

X6-MTH Related Tags

#DDR5#Windows 10#9~36V DC-in#Edge AI Computing#M.2#Out-Of-Band (OOB)#Intel® Core™ Ultra processors #AI#Windows 11#Intel#SIM Slot#CAN-Bus#Compact Size#4K2K Display#1G Ethernet#Windows#Linux#HDMI#VGA#Multiple Expansion#RoHS Certification#UL Certification#CE Certification#FCC Certification#UL-US Certification
System
Processor
Intel® Core™ Ultra 7 165U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 155U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 155U (2 P-Cores x 1.6 GHz, 8 E-Cores x 1.1 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 135U (2 P-Cores x 1.3 GHz, 8 E-Cores x 0.8 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 165H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 7 155H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 5 135H (4 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 18 MB cache, 28W)
Intel® Core™ Ultra 5 125H (4 P-Cores x 1.2 GHz, 8 E-Cores x 0.7 GHz, 18 MB cache, 28W)
Memory
Two 260-Pin SO-DIMM up to 64GB
Dual Channel DDR5 5600MHz
BIOS
AMI SPI
Graphics
Controller
Intel® Iris® Xe Graphics
Feature
DX12, Open GL 4.6, Vulkan 1.2
HW Decode: HEVC/VP9/AV1/AVC/H.265/MJPEG
HW Encode: HEVC/VP9/AV1/AVC/H.265/MJPEG
Display
1 x VGA
1 x HDMI
Storage
Interface
1 x 64GB/128GB/256GB/512GB/1024GB on board SSD
M.2 2280 M key (SATA 3 and PCIe gen3 x4 for NVMe)
Optional 1x 2.5” SATA tray kit
Expansion
Interface
1 x M.2 3042/3052 B key (PCIex2, USB 2.0) and 1 x Nano SIM slot
1 x M.2 2230 E key (PCIe x1, USB 2.0)
2 x M.2 2242/2280 M key (PCIe gen3 x1 for NVMe)
1 x M.2 A key for DFI OOB
Ethernet
Controller
1 RJ45 GbE from I226LM
1 RJ45 GbE from Intel i210AT
LED
Indicators
1 x Power Status
1 x HDD activity
Front I/O
Ethernet
2 x RJ45 GbE
Serial
1 combo DB-9 RS232/422/485/ CAN bus/ GPIO port
USB
2 x USB 3.2
2 x USB 2.0
Display
1 x VGA
1 x HDMI
DC in
1 x 4-pin power terminal block
Flank I/O
Antenna Hole
4 x antenna holes
Internal I/O
OOB
Support DFI OOB module
Security
TPM
TPM 2.0
Power
Type
9-36V DC
Connector
1 x 4-pin terminal block
RTC Battery
CR2032
OS Support
Microsoft
Windows 10, 11
Linux
Ubuntu 22.04
Environment
Operating Temperature
-20°C to 60°C (sku dependent)
Storage Temperature
-40°C to 85°C
Relative Humidity
5 to 95% RH (non-condensing)
Mechanism
Construction
Aluminum + SGCC
Mounting
Wall mount (mounting brackets and screws)
DIN mount by optional
Dimensions (W x H x D)
165 x 65 x 150 mm
Weight
< 2 kg
Standards and Certifications
Shock
· Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
· Non- Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
Vibration
· Operation
IEC 60068-2-64 Test Fh: Vibration board-band random test
Random,2Grms @ 5~500 Hz, 30min.
· Non- Operation
IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test
Sweep sine, 3Grms @ 10~500Hz, 30min.
Certifications
CE, FCC Class A, RoHS, UL 62368-1
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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