MTH966｜Intel®｜System-On-Modules｜DFI

Intel® Core™ Ultra Processor (Meteor Lake: U/H-series)
Intel® Core™ Ultra 7 165H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 7 155H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 5 135H (4 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 18 MB cache, 28W)
Intel® Core™ Ultra 5 125H (4 P-Cores x 1.2 GHz, 8 E-Cores x 0.7 GHz, 18 MB cache, 28W)
Intel® Core™ Ultra 7 165U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 155U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 135U (2 P-Cores x 1.6 GHz, 8 E-Cores x 1.1 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 125U (2 P-Cores x 1.3 GHz, 8 E-Cores x 0.8 GHz, 12 MB cache, 15W)

Dual Channel LPDDR5 memory down up to 64GByte

AMI BIOS

Intel® Iris® Xe graphics

DX12, Open GL 4.6, Vulkan 1.2 (Windows)
Mesa 3D, Open GL 4.6, Vulkan 1.2 (Linux)
HW Decode : 4K60 8b 4:2:0 AVC
HW Encode : 4K60 10b 4:4:4 HEVC/VP9/SCC 4K60 8b 4:2:0 AVC

1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DDI (2 DDI option with USB4)

VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
eDP: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz
DP++: resolution up to 4096x2304 @ 60Hz

VGA + LVDS + 3 DDI
VGA + LVDS + 3 DDI (available upon request)

8 x PCIe x1 (Gen4, Lanes 6/7 by option)
1 x PCIe x8 (Gen 5, H-Line only)
2 x PCIe x4 (Gen4, PEG_LANE4-7 option with NVMe SSD)
1 x I2C
1 x SMBUS
1 x LPC/eSPI
2 x UART

HD Audio

1 x Intel® I226 series (10/100/1000Mbps/2.5G), co-lay PCIe x1 (available upon request)

2 x USB 4.0 (BOM option with DDI)
3 x USB 3.2 Gen 2
8 x USB 2.0

2 x SATA 3.0 (up to 6Gb/s), co-lay PCIe x1 (available upon request)

1 x 8-bit DIO

1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request)

System Reset, Programmable via Software from 1 to 255 Seconds

Available Upon Request

8.5~20V, 5VSB, VCC_RTC (ATX mode)
8.5~12V, VCC_RTC (AT mode)

TBD

Windows 10 IoT Enterprise 64-bit
Windows 11

Linux

· Operating:
0°C~60°C (For H-Series Processor)
-40°C~85°C (For U-Series Processor)
· Storage:
-40°C~85°C

· Operating: 10%~90% RH
· Storage: 10%~90% RH

TBD

COM Express® Compact
95mm (3.74") x 95mm (3.74")

PICMG COM Express® R3.1, Type 6

CE, FCC, RoHS

Taiwan (TAA Compliant Country)