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F95000|NXP|System-On-Modules|DFI

F95000
Home System-On-Modules SMARC F95000
  • NXP i.MX95 series up to 6 Arm Cortex A55 cores
  • 2/4/8GB LPDDR5 Memory Down
  • Display Options: 1 Dual channel LVDS, 1 HDMI
  • Multiple Expansion: 2 PCIe 3.0
  • Rich I/O: 2 GbE LAN, 1 USB OTG, 1 USB 3.0, 3 USB 2.0

Status : Preliminary QUOTE NOW

Multiple Expansion
Rich I/O
LPDDR5
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RoHS Certification
CE Certification
FCC Certification

F95000 Related Tags

#LVDS#LPDDR5#NXP#eMMC#NXP i.MX95 Series#1G Ethernet#Linux#HDMI#RoHS Certification#CE Certification#FCC Certification
F95000|NXP|System-On-Modules|DFI
F95000|NXP|System-On-Modules|DFI
System
Processor
NXP i.MX95 series up to 6 Arm Cortex A55 cores, up to 2.0GHz
Memory
2/4/8GB LPDDR5-6400 Memory Down
Graphics
Controller
Arm® Mali ™ G310 GPU
Feature
OpenGL ES 3.2 Vulkan 1.2, OpenCL 3.0
Display
1 x Dual channel LVDS (default)
1 x 4-lanes MIPI-DSI, or 1 x HDMI (BOM option)
Expansion
Interface
2 x PCIe x1 (Gen 3)
1 x SDIO 3.0
4 x I2C
2 x SPI
2 x 4-wire UART and 2 x 2-wire UART
2 x CAN bus
1 x 4-lanes MIPI CSI
Optional 1 x 2-lanes CSI (BOM option with HDMI)
Audio
Interface
2 x I2S
Ethernet
Controller
2 x 10/100/1000Mbps GbE
1 x 10Gbps Ethernet port (BOM option)
I/O
USB
1 x USB OTG
1 x USB 3.0
3 x USB 2.0
eMMC
Supports eMMC 5.1, BGA-153 Ball up to 128GB
GPIO
1 x 14-bit GPIO
Wireless
Wireless
IEEE 802.11 ac/a/b/g/n wireless LAN + Bluetooth 5.0 (BOM option)
Security
TPM
TPM 2.0
Power
Type
5V DC-In
Consumption
TBD
OS Support
OS Support (UEFI Only)
Linux Yocto
Environment
Temperature
Operating: -5 to 65°C or -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
SMARC form factor
82 mm (3.23") x 50 mm (1.97")
Compliance
SMARC specification revision 2.1 compliance
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
• 1 F95000 board
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    F95000-BC41HC
    Part Number :
    TBD
    Description :
    6 CPU Cores, 4GB LPDDR5 Memory Down, LVDS, TPM 2.0, 3 USB 2.0, 16GB eMMC, Operating Temp.: -5 to 65oC
Optional Items
  • Item Name Part Number Description
  • Item Name :
    SMARC Carrier Board
    Part Number :
    Description :
  • Item Name :
    Heat spreader
    Part Number :
    Description :
  • Item Name :
    Heat sink
    Part Number :
    Description :

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