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EHL9A2|Intel®|System-On-Modules|DFI

EHL9A2
Home System-On-Modules COM Express Mini EHL9A2
  • Intel® Atom® Processor Elkhart Lake Series
  • Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
  • 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP
  • Multiple expansions: 4 PCIe x1
  • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1' 36 (Based on Intel IOTG Roadmap)

Status : Preliminary QUOTE NOW

Wide-temp: -40°C~85°C
4K2K Display
Multiple Expansion
Product Comparison
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Quotation
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CE Certification
FCC Certification

EHL9A2 Related Tags

#4K2K Display#1G Ethernet#Windows#Linux#HDMI#DDR4#Low Power Consumption#CE Certification#FCC Certification
System
Processor
Intel® Atom® Processor Elkhart Lake Series
Memory
Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® HD Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz
eDP: resolution up to 4096x2160 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz
DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz
Dual Displays
DDI + LVDS/eDP
Expansion
Interface
4 x PCIe x1 (Gen 3)
1 x SDIO (available upon request)
1 x I2C
1 x SMBus
1 x LPC
1 x CAN BUS
1 x Speaker
1 x SD 3.0
1 x SPI
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I225IT (10/100/1000Mbps/2.5Gbps)
I/O
USB
4 x USB 3.1 Gen2
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
eMMC
1 x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request)
DIO
1 x 8-bit DIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
4.75V~20V, 5VSB, VCC_RTC (ATX mode)
4.75V~20V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
OS Support
Windows: Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: -5 to 65°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM Express® Mini 84mm (3.3") x 55mm (2.16")
Compliance
PICMG COM Express® R3.0, Type 10
Standards and Certifications
Certifications
CE, FCC
Packing List
Packing List
Heat Sink (For HIS CPU) A71-008170-000G
Heat Sink (For BARE-DIE CPU) A71-008170-010G
Cooler A71-108143-000G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    EHL9A2-TC16-6425RE
    Part Number :
    770-EHL9A21-000G
    Description :
    Intel® Atom® x6425RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C
  • Model Name :
    EHL9A2-TC16-6414RE
    Part Number :
    770-EHL9A21-100G
    Description :
    Intel® Atom® x6414RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C
  • Model Name :
    EHL9A2-TC86-6212RE
    Part Number :
    770-EHL9A21-200G
    Description :
    Intel® Atom® x6212RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C
  • Model Name :
    EHL9A2-BC86-J6426
    Part Number :
    770-EHL9A21-300G
    Description :
    Intel® Atom® J6426, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -5 to 65°C
  • Model Name :
    EHL9A2-BC86-N6211
    Part Number :
    770-EHL9A21-400G
    Description :
    Intel® Atom® N6211, LPDDR4 8GB on board, eMMC 64GB, eDP, SDIO, -5 to 65°C
  • Model Name :
    EHL9A2-TC86-6425RE
    Part Number :
    770-EHL9A21-500G
    Description :
    Intel® Atom® x6425RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat Spreader
    Part Number :
    A71-808341-010G
    A71-808341-020G
    Description :
    For HIS CPU
    For BARE-DIE CPU
  • Item Name :
    COM100-B Carrier Board Kit
    Part Number :
    770-COM104-000G
    Description :

Dominate Edge Computing: EHL Series Based on Ultra Low Power Intel® Atom™ x6000 Series

DFI's new-gen EHL Series embedded computing solutions powered by the Intel® Atom™ x6000 series processors are tailored to enhance the management and synergy of IoT devices. The new SoC delivers a 1.7x improvement in single-thread performance and up to 2x performance improvement in graphics than the previous generation. The performance enhancement enables remote industrial controlling devices, Kiosk,medical moniroting devices, or mobile AGV/AMR to quickly respond to edge events and optimize the efficiency of synchronization and collaboration between edge devices through intelligent management for a more comprehensive and seamless system of automation.

Power IoT in Various Scenarios

As IT infrastructures are moving to the edge, they emphasize real-time responsiveness, low power consumption, and environmental resilience of devices more. DFI specially designs the EHL series industrial motherboards, computers on module, and fanless embedded systems based on Intel® Atom™ x6000 processors. Besides having boards in form factors ranging from SBC and Mini-ITX, to COM Express Compact and COM Express Mini, DFI also provides small industrial computers that can easily overcome environmental constraints on IoT device deployment by operating efficiently at -40 to 85°C. From SBC, Mini-ITX, COM Express Compact, COM Express Mini, to small PCs, the EHL series offers more options on computing performance ranging from 4.5W to 12W, and ensures to operate efficiently with the ambient temperature at -40 ~ 85°C to achieve IoT devices management and real-time response in various industrial controls, AGV/robot control, remote medical monitoring, medical display, and transportation management.

Latency Free in Data Transmission

The independent 2.5G LAN provides amazingly faster transfer experience than the generic 1G LAN, and can simultaneously optimize the synergy between edge devices to be more real-time and seamless by the built-in in-band management functions, vPro and AMT. On the other hand, the EHL series also supports broadband wireless transmission 5G and Wifi 6, eliminating the limits that the cables bring for device deployment.

Fast and Diverse Connectivity

The EHL series leverages the high-speed PCIe Gen3 signal to achieve significant optimization in expansion and connection. In addition to DDR4-3200 memory supporting up to 32G, the EHL series also provides PCIe x4 and PCIe x1 slots, M.2 B & E key, nano SIM slots, and various I/Os such as LAN, COM, USB 3.1 Gen2, and SATA that greatly enhance the responsiveness of edge control, expansion, and connectivity.

Triple 4K HDR deliver stunning visuals

The EHL series can connect up to three 4K Ultra HD independent displays at the same time, providing a delicate and fast display of every detail for an unparalleled visual experience in industrial, retail, and shopping mall digital signage applications.

Robust Remote Manageability

The EHL series introduces vPro and AMT, which were supported only on desktop and server models, into the Atom platform to monitor as well as manage remote devices and update their operating systems and software through in-band signaling by Wi-Fi or wired Ethernet. Even when the operating system is down, the out-of-band management function can recover the system and application easily to reduce the downtime.

100% In-house Boards

From design, development, to production, DFI’s motherboards follow the 100% in-house production principle, guaranteeing manufacture quality and information confidentiality. Developed on the basis of these boards and integrated into durable chassis, our embedded systems are also ensured by turnkey services and timely post-sales assistance.

Industrial-grade Long Term Support

Long life cycle support, no risk occurred. With product life cycle support of up to 15 years, DFI guarantees performance, quality, and future repair and replacement.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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