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GH9A3｜AMD®｜System-On-Modules｜DFI

GH9A3
Overview
Overview
Specification
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Ordering Information
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Home System-On-Modules COM Express Mini GH9A3
  • AMD® Ryzen™ R1000 Series Processor
  • Single Channel LPDDR4 2400MHz；Memory Down up to 8GB
  • 1 LVDS/eDP, 1 DDI (HDMI/DP)；Supports dual displays: DDI + LVDS/eDP
  • Multiple expansions: 3 PCIe x1
  • Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q1' 28 (Based on AMD Roadmap)

Status : Launched QUOTE NOW

Wide-temp: -40°C~85°C
DDR4
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RoHS Certification

GH9A3 Related Tags

#IoT#AMD#Windows#Linux#HDMI#DP#DDR4#RoHS Certification
GH9A3
GH9A3

Related Products:

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System
Processor
AMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12W
AMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12W
AMD® Ryzen™ Embedded R1000 series
Memory
4GB/8GB Memory Down
Single Channel LPDDR4 2400MHz
BIOS
SPI 64Mbit (default supports fTPM2.0)
Graphics
Controller
Radeon™ Vega 3 Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DP++)
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz
DP++: resolution up to 3840x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Displays
DDI + LVDS
DDI + eDP
Expansion
Interface
3 x PCIe x1 (Gen 3)
1 x SDIO
1 x LPC
2 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I210 (10/100/1000Mbps)
I/O
USB
2 x USB 3.1
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
GPIO
1 x 8-bit GPIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
BIOS default support FTPM, TPM2.0 by request.
Power
Type
12V~20V, 5VSB, VCC_RTC (ATX mode)
12V~20V, VCC_RTC (AT mode)
Consumption
Typical : R1606G : 5V @ 2.71A (13.55W)
Max : R1606G : 5V @ 5.52A (27.6W)
OS Support
OS Support (UEFI Only)
Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
327,852 hrs @25C ; 162,213 hrs @45C ; 89,021 hrs @60C
Calculation Model : Telcordia Issue 4
Environment : GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
COM Express® Mini
84mm (3.30") x 55mm (2.16")
Compliance
PICMG COM Express® R3.0, Type 10
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Product Collaterals
Technical Documents
Certifications
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    GH9A3-B40-R15     Part Number :
     770-GH9A31-000G     Description :
    AMD® Ryzen™ Embedded R1505G, 4G Memory onboard, DIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Heat Sink, 0 to 60°C
  • Model Name :
    GH9A3-T40-R16     Part Number :
     770-GH9A31-100G     Description :
    AMD® Ryzen™ Embedded R1606G, 4G Memory onboard, DIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Cooler, -40 to 85°C
  • Model Name :
    GH9A3-T80-R16     Part Number :
     770-GH9A31-200G     Description :
    AMD® Ryzen™ Embedded R1606G, 8G Memory onboard, SDIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Cooler, -40 to 85°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    COM100-B Carrier Board Kit     Part Number :
     770-COM104-000G     Description :
  • Item Name :
    COM335 Carrier Board Kit     Part Number :
     770-CM3351-000G     Description :

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