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AL9A2|Intel®|System-On-Modules|DFI

AL9A2
Home System-On-Modules COM Express Mini AL9A2
  • Intel Atom® E3900 Processor Series
  • Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
  • Multiple expansions: 4 PCIe x1
  • 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP
  • Dual Channel DDR3L 1600MHz Memory Down up to 8GB
  • 15-Year CPU Life Cycle Support Until Q4' 32 (Based on Intel IOTG Roadmap)

Status : Launched QUOTE NOW

Wide-temp: -40°C~85°C
Fanless Design
Compact Size
4K2K Display
Multiple Expansion
Product Comparison
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RoHS Certification
CE Certification
FCC Certification

AL9A2 Related Tags

#IoT#Intel#Fanless Design#Compact Size#4K2K Display#Windows#Linux#HDMI#DP#Multiple Expansion#DDR3L#RoHS Certification#CE Certification#FCC Certification
COM Express Type 10, AL9A2
COM Express Type 10, AL9A2
System
Processor
Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory
4GB/8GB DDR3L Memory Down (ECC support only for 8GB)
Single Channel DDR3L 1600MHz
BIOS
AMI SPI 128Mbit (supports UEFI boot only)
Graphics
Controller
Intel® HD Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DVI/DP)
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz
HDMI: resolution up to 3840 x 2160 @ 30Hz
DP++: resolution up to 4096x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Displays
DDI + LVDS
DDI + eDP
Expansion
Interface
4 x PCIe x1 (Gen 2)
1 x SDIO (available upon request)
1 x LPC
2 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I210AT (10/100/1000Mbps) (0°C to 60°C)
1 x Intel® I210IT (10/100/1000Mbps) (-40°C to 85°C)
I/O
USB
2 x USB 3.0
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
eMMC
1 x 8GB/16GB/32GB/64GB eMMC (available upon request)
GPIO
1 x 8-bit GPIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode)
Consumption
Typical: E3950: 12V @ 0.44A (5.28W)
Max.: E3950:12V @ 1.89A (22.68W)
OS Support
OS Support (UEFI Only)
Windows: Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
2,230,979 hrs @ 25°C; 1,334,511 hrs @ 45°C; 862,577 hrs @ 60°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
COM Express® Mini
84mm (3.30") x 55mm (2.16")
Compliance
PICMG COM Express® R2.1, Type 10
Standards and Certifications
Certifications
CE, FCC Class B, RoHS
Packing List
Packing List
1 AL9A2 board
1 Heat sink: A71-008114-000G (E Series); A71-008114-010G (N Series)
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    AL9A2-T80-E3940
    Part Number :
    770-AL9A21-000G
    Description :
    Fanless, Intel Atom E3940, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L Memory Down, -40 to 85°C
  • Model Name :
    AL9A2-B80-E3950
    Part Number :
    770-AL9A21-100G
    Description :
    Fanless, Intel Atom E3950, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L Memory Down, 0 to 60°C
  • Model Name :
    AL9A2-T40-E3930
    Part Number :
    770-AL9A21-200G
    Description :
    Fanless, Intel Atom E3930, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, -40 to 85°C
  • Model Name :
    AL9A2-B40-N4200
    Part Number :
    770-AL9A21-300G
    Description :
    Fanless, Intel Pentium N4200, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, 0 to 60°C

* N4200 is supported upon request with MOQ requirement

Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat spreader
    Part Number :
    A71-808304-000G (E Series)
    A71-808305-000G (N Series)
    Description :

  • Item Name :
    COM100-B carrier board kit
    Part Number :
    770-COM104-000G
    Description :

Rugged Design and Energy-Efficiency for Deeply Embedded Applications

DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.

Wide Operating Temperature with Fanless Design

These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.

Energy Saving but High Performance

With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.

Experience Clarity with 4K UHD High-Resolution

The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for medical and multimedia solution.

Multiple Storage Choice: eMMC, SSD/ M.2 Module

As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB. Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice for automation, storage and design of IoT appliances.

Complete Product Line

Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1.

Endless IoT Possibilities with Windows 10 Compatibility

Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started