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CS332-Q370|Intel®|Industrial Motherboards|DFI

Home Industrial Motherboards microATX CS332-Q370
  • 9th/8th Gen Intel® Core™ with Intel® Q370
  • 4 DDR4 DIMM up to 128GB
  • Dual display ports: VGA + DP++ + DP++ Supports triple independent displays
  • Rich I/O: Up to 4 GbE (2 default), 4 COM, 6 USB 3.2 Gen1, 6 USB 2.0
  • Multiple expansion: 1 PCIe x16, 2 PCIe x4, 1 PCI, 1 Mini PCIe, 1 M.2 M key (support Optane Memory), 1 M.2 E key
  • 15-Year CPU Life Cycle Support Until Q2' 33 (Based on Intel IOTG Roadmap)

Status : Launched BUY ONLINE (US)

4K2K Display
PCIe x16
Multiple Expansion
Product Comparison
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CS332-Q370 Related Tags

#IoT#Intel#Mini PCIe#4K2K Display#PCIe x16#Windows#Linux#VGA#DP#Multiple Expansion#DDR4#RoHS Certification#Legacy ISA/PCI Expansion Port
CS332-Q370|Intel®|Industrial Motherboards|DFI
CS332-Q370|Intel®|Industrial Motherboards|DFI
CS332-Q370|Intel®|Industrial Motherboards|DFI
CS332-Q370|Intel®|Industrial Motherboards|DFI
8th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors, TDP support up to 95W:
Intel® Core™ i7-8700 (6 Cores, 12M Cache, up to 4.6 GHz); 65W
Intel® Core™ i7-8700T (6 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Core™ i5-8500 (6 Cores, 9M Cache, up to 4.1 GHz); 65W
Intel® Core™ i5-8500T (6 Cores, 9M Cache, up to 3.5 GHz); 35W
Intel® Core™ i3-8100 (4 Cores, 6M Cache, 3.6 GHz); 65W
Intel® Core™ i3-8100T (4 Cores, 6M Cache, to 3.1 GHz); 35W
Intel® Pentium® G5400 (2 Cores, 4M Cache, 3.7 GHz); 58W
Intel® Pentium® G5400T (2 Cores, 4M Cache, 3.1 GHz); 35W
Intel® Celeron® G4900 (2 Cores, 2M Cache, 3.1 GHz); 54W
Intel® Celeron® G4900T (2 Cores, 2M Cache, 2.9 GHz); 35W

9th Generation Intel® Core™ LGA 1151 Socket Processors, TDP support up to 95W:
Intel® Core™ i7-9700E (8 Cores, 12M Cache, up to 4.4 GHz); 65W
Intel® Core™ i7-9700TE (8 Cores, 12M Cache, up to 3.8 GHz); 35W
Intel® Core™ i5-9500E (6 Cores, 9M Cache, up to 4.2 GHz); 65W
Intel® Core™ i5-9500TE (6 Cores, 9M Cache, up to 3.6 GHz); 35W
Intel® Core™ i3-9100E (4 Cores, 6M Cache, 3.7 GHz); 65W
Intel® Core™ i3-9100TE (4 Cores, 6M Cache, to 3.2 GHz); 35W
Intel® Q370 Chipset
Four 288-pin DIMM up to 128GB
Dual Channel DDR4 2400/2666 MHz (non ECC support)
AMI SPI 128Mbit
Intel® HD Gen 9 Graphics
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
1 x VGA
2 x DP++
VGA: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2106 @ 60Hz
Triple Displays
VGA + DP++ + DP++
1 x PCIe x16 (Gen 3)
2 x PCIe x4 (Gen 3)
1 x PCI
1 x MINI PCIE SLOT (Full Size)
1 x M.2 2242/2280 M key (PCIe Gen3 x 4 NVMe/Intel Optane Memory Support)
1 x M.2 2230 E key (PCIe x1/USB2.0)
Audio Codec
Realtek ALC888S
1 x Intel® i219LM PCIe (10/100/1000Mbps) (only Core i7/i5 support iAMT)
1 x Intel® i210AT PCIe (10/100/1000Mbps)
2 x Intel® i210AT PCIe (10/100/1000Mbps) (opt. by request, MOQ required)
Rear I/O
2 x GbE (RJ-45), 4 x GbE (RJ-45) (opt. by request, MOQ required)
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
4 x USB 3.2 Gen 1
2 x USB 2.0
1 x PS/2 (mini-DIN-6)
1 x VGA
2 x DP++
1 x Line-out
1 x Line-in (colay, opt. by request, MOQ required)
1 x Mic-in
Internal I/O
3 x RS-232
2 x USB 3.2 Gen 1
4 x USB 2.0 (2.54mm pitch)
1 x S/PDIF, 1 x Front Audio Header
4 x SATA 3.0 (up to 6Gb/s) (opt. x5 SATA) RAID 0/1/5/10
1 x 8-bit DIO
1 x LPC (support LPC EXT-RS-232/485 module)
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 sec/min
TPM 2.0
8-pin ATX 12V power
24-pin ATX power
Typical: i7-8700K: 3.3V @ 0.44A (1.452Watt); 5V @ 0.62A (3.1Watt); 12V @ 0.49A (5.88Watt)
Max.: i7-8700K:3.3V @ 0.51A (1.683Watt); 5V @ 1.4A (7.0Watt); 12V @ 10.44A (128.25Watt)
RTC Battery
CR2032 Coin Cell
OS Support
OS Support
Windows 10 IoT Enterprise 64-bit
Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
Operating: 5 to 90% RH
Storage: 5 to 90% RH
596,170 hrs @ 25°C; 341,995 hrs @ 45°C ; 213,835 hrs @ 60°C ; 182,033 hrs @ 65°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled
microATX form factor
244mm (9.6") x 244mm (9.6")
PCB: 1.6mm
Top Side: 38.5mm
Bottom Side: 4.4mm
Packing List
Packing List
1 CS332-Q370 motherboard
1 Serial ATA data cable (W/LOCK, Length: 500mm) 332-553001-005G
1 I/O shield for 2 LAN default (770-CS3321-100G) A49-CS3320-010G
1 I/O shield for 4 LAN option (770-CS3321-200G) A49-CS3320-000G
1 M.2 2242/2260/half mini PCIe standoff A33-725019-090G
2 M.2 Screw A32-112016-041G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    Part Number :
    Description :
    4 DDR4 DIMM, 2 LAN, 4 COM, 12 USB, 0 to 60°C
  • Model Name :
    Part Number :
    Description :
    4 DDR4 DIMM, 4 LAN, 4 COM, 12 USB, 0 to 60°C
  • Model Name :
    Part Number :
    Description :
    4 DDR4 DIMM, 2 LAN, 4 COM, 12 USB, 1 TPM 2.0, 0 to 60°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    USB 2.0 port cable
    Part Number :
    Description :
    Length: 350mm
  • Item Name :
    USB 3.1 Gen 1 cable
    Part Number :
    Description :
    Length: 320mm
  • Item Name :
    COM port cable
    Part Number :
    Description :
    Length: 300mm, 2 x COM ports
  • Item Name :
    Serial ATA data cable
    Part Number :
    Description :
    Length: 500mm, W/LOCK
  • Item Name :
    Thermal solution
    Part Number :
    Description :
    For 35W, Height: 37.3mm
    For 65W, Height: 74.47mm
    For 95W, Height: 77.2mm
  • Item Name :
    LPC EXT-RS232 module
    Part Number :
    Description :
    4 x RS232 ports
  • Item Name :
    LPC EXT-RS485 module
    Part Number :
    Description :
    4 x RS485 ports
  • Item Name :
    DP to HDMI dongle
    Part Number :
    Description :
  • Item Name :
    Front Audio cable
    Part Number :
    Description :
    Length: 300mm

Based on 8th Gen Intel® Core™ Processors

DFI’s brand new board series with 8th Generation Intel® Core™ processors are ideally designed for what’s coming in the new era. We have a full form factor lineup from Mini-ITX, micro-ATX, ATX, to SOM integrated with better CPU performance support with up to 6 processor cores increasing 10% performance than previous generation even when multitasking.

Complete Product Line

DFI offers a complete product series from different form factor motherboards like ATX, microATX, Mini-ITX, and system-on-modules based on 8th Generation Intel® Core™ Processor Family with high-performance design. It is able to be perfectly fitted into different applications.

Optimized Productivity & Responsiveness

DFI’s product series are supported with Intel® Optane™ memory to accelerate computer’s responsiveness to multitask workloads without wasting too much time. Additionally, our products support with 64 GB DDR4 RAM memory up to 2666 MHz to enhance better memory bandwidth and memory transfer speeds. DFI’s motherboard comes with an M.2 (2280) to support NVMe drives with write speeds up to 3500MB/s which are 7 times over SATA SSDs.

Improved and Multiple I/O Options

Our product series with 8th gen processors adopt the newest technology USB Type-C and USB 3.1 Gen2 to benefit data transfer rates of up to 10 Gbps. It’s two times faster than USB 3.0. Furthermore, our ATX motherboard series come with Intel Q370 chipset and 24 PCIe lanes, which have 4 more PCIe lanes than the Intel Q170 chipset motherboard. This enables rich I/Os and multiple expansions, making it an ideal solution for machine vision and industrial automation application.

Fantastic Visual Performance

DFI’s completed product series with Intel 8th gen processors have the capability of delivering advanced 4K video experiences supported with resolution higher than 1080p and high quality UHD streaming media for applications such as digital signage, digital security, and surveillance.

Enhanced Security Protection

For defending equipment from external threats of security awareness, DFI’s motherboards are available with the advanced feature of iAMT 12.0 for remote management and repair of systems. Aside from iAMT 12.0, DFI’s motherboards are supported with TPM 2.0 for protecting confidential data and improving system integrations.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started