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About Press Room DFI Announces HR902 COM Express Basic Type 2 Based on the Intel® QM67 Express Chipset
Product News

DFI Announces HR902 COM Express Basic Type 2 Based on the Intel® QM67 Express Chipset

2013/07/17 (UTC-6)

DFI®, a leading provider offering a wide range of products for diversified industry applications, today launches a new Type 2 COM Express basic module, the HR902-B, which comes with BGA 1023 packaging technology for the low-power 3rd/2nd generation Intel®Core™ processors based on 22/32-nanometer process technology. It is a new COM Express form factor that supports the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and i5-3610ME, as well as the mainstream performance i3-3217UE and i3-3120ME. The Mobile Intel®QM67 chipset paired with this COM Express basic module provides excellent processing performance in media, graphics and I/O flexibilities, and stunning and seamless visual experiences.

 

The next-generation Intel® HD Graphics 4000/3000 engine integrated into this Intel® Core™ processor-based platform supports high-end enhanced media and graphics capabilities and improves performance. The Intel® Clear Video Technology offers advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion. Performance is further increased through the introduction of DirectX Video Acceleration (DXVA) for providing acceleration of complex audio, video, and image processing. Additional features with Graphics APIs, including DirectX 11/10.1/10/9 and OGL 3.0, provide integrated Intel® graphics accelerator with VGA and LVDS display ports to support 2 independent displays.

 

The HR902-B mobile platform with 2 DDR3/DDR3L SODIMM sockets delivers maximum performance with up to 16GB or 066/1067/1333/1600MHz low voltage memory for faster communication between components. The memory controller and graphics core are placed on the processor die to provide a tightly-coupled, two-chip system architecture resulting in higher performance and lower power consumption.

 

In addition, the HR902-B is packed with high performance and flexible I/O with the Mobile Intel® QM67 chipset. It also provides HD Audio interface, 2 IDE devices, 8-bit Digital I/O connector for device controls, 1 Intel® Gigabit LAN controller to increase transmission speed for network-intensive applications, 1 LPC interface, 1 SMBus interface and 2 Digital Display Interfaces which multiplex PCIe x16. The Advanced Host Controller Interface (AHCI) controller integrated into the HR902-B mobile module supports 4 Serial ATA interfaces: 2 Serial ATA 3.0 ports with data transfer rate up to 6Gb/s and 2 Serial ATA 2.0 ports with data transfer rate up to 3Gb/s supporting RAID 0/1/5/10 for applications that need fast storage speed. With 8 USB 2.0 ports, this new mobile platform allows your system to process more data load and provide faster loading of frequently used applications.

 

The HR902-B also comes with multiple expansion configurations, including 1 PCIe x16 slot multiplexing digital display interface for high erformance graphics displays, 4 PCI (PCI 2.3) slots, and 1 PCIe x4 and 1 PCIe x1 slots (default); or 5 PCIe x1 slots, to offer additional capabilities for customers’ various of demands.

 

All these features described above combined with the HR902-B mobile module, make it an ideal product for a whole range of applications which require a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, and KIOSK embedded pplications.



HR902-B Features


• PICMG COM Express R2.1 basic form factor, Type 2 (95mm x 125mm)
• Supports Intel® Core™ 3rd/2nd generation i7/i5/i3 processors (BGA 1023)
• Mobile Intel® QM67 chipset
• Up to 16GB of DDR3/DDR3L 1066/1067/1333/1600MHz, dual-channel memory interface
• 1 LVDS and 1 VGA interfaces support 2 independent displays
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
  2 SATA 2.0 with data transfer rate up to 3Gb/s
• 8 USB 2.0 ports
• 1 Intel® Gigabit LAN interface
• 1 PCIe x16 slot
  1 PCIe x4 slot and 1 PCIe x1 slot
  4 PCI slots (PCI 2.3)
• 1 LPC interface
• 2 IDE devices
• 1 SMBus interface
• 8-bit Digital I/O connector
• 2 DDI multiplex with PCIe x16
• Operating Temperature Range: 0°C to 60°C


All product specifications are subject to change without notice.
Intel and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: inquiry@dfi.com.tw
For more information on the HR902-B COM Express Basic Module, please visit: www.dfi.com

 


About DFI

Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical iagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI works closely with Intel® on development of next-eneration standards-based building blocks, platforms and solutions for the communications and embedded market segments.


DFI Inc.

100, Huanhe St., Xizhi Dist.,
New Taipei City 22154, Taiwan (R.O.C.)
Tel: +886(2)2694-2986
Fax: +886(2)2694-5815
E-Mail: inquiry@dfi.com.tw
Website: http://www.dfi.com