DFI, a leading provider of embedded boards and systems, today announces a new Type of 2 COM Express basic form factor, the CR902-B, in its mobile Intel® QM77 product line. This module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel® Core™/Celeron®processor family, the next generation of 64-bit, multi-core processors built on 22/32-nanometer process technology delivering up to 15% CPU performance increase from previous generations. This new mobile form factor supports the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and i5-3610ME, as well as the mainstream performance i3-3217UE and i3-3120ME. These processors offer higher performance, are more cost-effective and lower power consumption than the 2nd generation processors which are also supported on this module.
This new mobile platform with 2 DDR3/DDR3L SODIMM sockets delivers maximum performance with up to 16GB or 1066/1067/1333/1600MHz low voltage memory for faster communication between components. This cost-effective COM Express form factor also takes full advantage of the mobile-based Intel® QM77 Express chipset, packed with high performance and flexible I/O capabilities to provide increased mobile computing and graphics performance.
The Intel® HD Graphics 4000/3000 engine integrated into these processors with high quality playback supports Intel® Clear Video Technology that supplies advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion and delivers up to 50% significant 3D graphics performance improvement. Performance is further increased through the introduction of Intel® DirectX Video Acceleration (DXVA) for providing acceleration of complex audio, video, and image processing. Additional features supporting Graphics APIs, including DirectX 11/10.1/10/9 and OGL 3.0 provide integrated Intel® graphics accelerator with VGA and LVDS display ports with resolution up to 2048 x 1536.
The CR902-B with high performance and flexible I/O also provides HD Audio interface, 2 IDE devices, 8-bit Digital I/O connector for device controls, 1 Intel® Gigabit LAN controller to increase transmission speed for network-intensive applications, 1 LPC interface, 1 SMBus interface and 2 Digital Display Interfaces which multiplex PCIe x16. The Advanced Host Controller Interface (AHCI) controller integrated into the CR902-B mobile module supports 4 Serial ATA interfaces: 2 Serial ATA 3.0 ports with speed up to 6Gb/s and 2 Serial ATA 2.0 ports with speed up to 3Gb/s supporting RAID 0/1/5/10 for applications that need fast storage speed. With 8 USB 2.0 interfaces, this new mobile platform allows your system to process more data load and provides faster loading of frequently used applications.
In addition, the CR902-B basic form factor also comes with multiple expansion configurations, including 1 PCIe x16 slot multiplexing digital display interface for high performance graphics displays, 4 PCI (PCI 2.3) interfaces, and 1 PCIe x4 and 1 PCIe x1 slots; or 5 PCIe x1 slots to offer additional capabilities for customers' various of demands.
With all these combined features described above, this new mobile embedded module board, CR902-B, is an ideal product for a whole range of applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.
• PICMG COM Express R2.1 basic form factor, Type 2 (95mm x 125mm)
• Supports Intel® Core™/Celeron™ 3rd/2nd Gen i7/i5/i3 processors (BGA 1023)
• Mobile Intel® QM77 Express Chipset
• Up to 16GB of DDR3/DDR3L 1066/1067/1333/1600MHz, dual-channel memory interface
• 1 LVDS and 1 VGA interfaces support 2 independent displays
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• 8 USB 2.0 ports
• 1 Intel® Gigabit LAN interface
• 1 PCIe x16 slot
1 PCIe x4 and 1 PCIe x1 slots; or 5 PCIe x1 slots
4 PCI slots
• 1 LPC interface
• 2 IDE devices
• 1 SMBus interface
• 8-bit Digital I/O connector
• 2 DDI multiplex with PCIe x16
• Operating Temperature Range: 0°C to 60°C
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an e-mail: email@example.com
For more information on the CR902-B COM Express Basic Module, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.