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About Press Room COM Express Compact Module with 3rd Generation Intel® Core™ Processor Supports 3 Independent Displays
Product News

COM Express Compact Module with 3rd Generation Intel® Core™ Processor Supports 3 Independent Displays|Press Room|DFI

COM Express Compact Module with 3rd Generation Intel® Core™ Processor Supports 3 Independent Displays

2012/07/09 (UTC-6)

DFI today announces the CR908-B, the first COM Express Compact module in DFI's product line based on the new Mobile Intel® QM77 Express chipset. This Type 6 module supports the 3rd generation Intel® Core™ processors in BGA 1023 package. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. These processors also offer higher performance at lower power consumption than the 2nd generation processors which are also supported on these module boards.

The Intel® HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. The Intel® Clear Video HD Technology provides advanced imaging capability for Blu Ray and other high definition video processing. Graphics APIs include DirectX 11, and OpenGL 3.1. Targeted for medical and gaming applications, CR908-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, and DisplayPort) allowing you to choose the best combination to suit various applications requirements.

The low power module boards take full advantage of the Mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance. With the new USB 3.0, it allows your system to process more data load. It provides 4 USB 3.0/2.0, 4 USB 2.0, 2 SATA 3.0 ports with speed up to 6Gb/s, 2 SATA 2.0 ports with speed up to 3Gb/s, 1 SMBus, 1 I2C, and 4-bit input and 4-bit output GPIO for device controls.

The board offers additional expansion capability via 1 PCIe x16 slot for video capture card, and 1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1 slot.

• COM Express Compact (95mm x 95mm)
• 3rd generation Intel® Core™ processors (BGA)
  - Intel® Core™ i7-3615QE (6M Cache, up to 3.3GHz); 45W
  - Intel® Core™ i7-3612QE (6M Cache, up to 3.1GHz); 35W
  - Intel® Core™ i7-3555LE (4M Cache, up to 3.2GHz); 25W
  - Intel® Core™ i7-3517UE (4M Cache, up to 2.8GHz); 17W
  - Intel® Core™ i5-3610ME (3M Cache, up to 3.3GHz); 35W
  - Intel® Core™ i3-3120ME (3M Cache, 2.4GHz); 35W
  - Intel® Core™ i3-3217UE (3M Cache, 1.6GHz); 17W
• Mobile Intel® QM77 Express chipset
• 1 DDR3/DDR3L 1066/1333/1600MHz SODIMM up to 8GB
• VGA, LVDS and DDI (HDMI, DVI, and DisplayPort) supports up to 3 independent displays
• 1 Intel® Gigabit LAN controller
• 4 USB 3.0/2.0
  4 USB 2.0
• 2 SATA 3.0 (6Gb/s)
  2 SATA 2.0 (3Gb/s)
• 4-bit input and 4-bit output GPIO
• 1 PCIe x16
  1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1

The mobile embedded module board is ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.
All product specifications are subject to change without notice.
Intel® and Intel® Core™ are trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: inquiry@dfi.com
For more information on the CR908-B COM Express module, please visit: www.dfi.com

About DFI

Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 30 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI® uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DF® works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.

DFI Inc.

100, Huanhe St., Xizhi Dist.,
New Taipei City 22154, Taiwan (R.O.C.)
Tel: +886 (2) 2694-2986
Fax: +886 (2) 2694-5815
Sales E-Mail: inquiry@dfi.com
Website: https://www.dfi.com