Taipei, Taiwan – DFI, a global leader in embedded motherboards and industrial computing, will showcase a comprehensive edge computing lineup for key applications in smart cities, industrial automation, intelligent transportation, and healthcare. Centered on “Accelerating Edge AI Innovation for a Sustainable Future,” DFI will feature a hybrid AI Box powered by Intel® and NVIDIA Jetson™ platforms, integrating AI with OOB (Out-of-band) remote management for high-efficiency, energy-saving edge solutions. Additionally, DFI will present compact and energy-efficient OSM industrial modules, in-vehicle systems, rugged industrial computing devices, and industrial-grade servers, highlighting its technological expertise and strategic presence in the edge AI market.
DFI unveils powerful edge AI platforms with Intel, AMD, and ARM-based solutions, integrating AI accelerators from Intel, NVIDIA, DEEPX, and Hailo for scalable, energy-efficient computing. In partnership with Chunghwa Telecom, DFI's X6-MTH-ORN hybrid AI Box enhances public security, traffic management, and environmental protection through intersection monitoring, AI-driven traffic enforcement, and illegal scooter exhaust detection, accelerating smart city development. This system seamlessly integrates Intel and Jetson platforms with DFI’s in-house Out-of-Band (OOB) management module and edge AI capabilities, optimizing operational efficiency and AI performance. Also featured are the VC700-ASL, VC70B-MTH and UPS-IP300 reinforcing DFI’s commitment to intelligent transportation and interoperability in smart mobility networks as an ITxPT member.
DFI’s ruggedized platforms are designed for mission-critical applications in harsh environments. QRB812, a compact 45mm × 45mm OSM powered by the Qualcomm QRB5165 processor, offers vibration resistance and supports up to six MIPI-CSI camera interfaces. It is specifically designed for mission-critical AI applications in smart surveillance, unmanned aerial vehicles (UAVs), and automated inspection systems, with ongoing UAV projects in progress. Meanwhile, the ECX700-ADP and ECX700-ASL showcased ensure mission-critical durability, making them ideal for challenging environments.
DFI also partners with Irontech Group, a Spain-based leader in touchscreen PCs and industrial monitors, will showcase advanced, made-in-Europe panel PCs designed for rugged and harsh environments. These include ATEX, IP69K solutions for the food industry, along with systems for marine applications, industrial automation, and logistics ecosystems.
DFI highlights expandability as a core theme, led by the EC633D-RPS, an expandable fanless embedded system powered by 65W 14th/13th/12th Gen Intel® Core™ processors and a full-length high-performance GPU, enabling seamless on-device LLM deployment at the edge with models like DeepSeek. The edge server lineup features the MPC350-RPS, a medical-grade AI server, supporting the latest RTX5070 GPU, and the RM646-ERX810, a 4U short-depth server with dual 5th Gen Intel® Xeon® processors, PCIe Gen 5, and support for up to 3 double-width PCIe GPUs with excellent ventilation, designed for AI-intensive workloads. DFI also partners with AEWIN to showcase AEWIN’s 2U edge server BAS-6101A, designed for large-scale cloud computing and high-performance computing. Additionally, in collaboration with DEEPX, DFI integrates the DX-M1 M.2 AI accelerator into the EC700-ADN, an ultra-compact fanless system, enhancing AI performance for any demanding applications.
Building on its commitment to high-performance computing, DFI introduces the ARS630 industrial ATX motherboard, supporting the latest Intel Arrow Lake processors. Displayed alongside the RPS630 ATX motherboard, it showcases how virtualization enhances hardware utilization and reduces TCO in factory automation, smart retail, and beyond.
Visit DFI’s booth (Hall 3-533) at Messe Nuremberg from March 11–13, 2025. As a Taiwan Excellence Award honoree, DFI will also showcase its cutting-edge industrial computers at the Taiwan Excellence booth (Hall 2-313).