DFI today launches a new Type 6 COM Express Basic module, the HM960-QM87, in its Mobile Intel® QM87 chipset-based product line that provides low-power consumption and higher performance. This new COM Express Basic module with BGA 1364 packaging technology supports the 4th generation Intel®Core™ processors built on 22-nanometer process technology and boasts a 5~15% CPU performance increase compared with its previous generations. This low-power module board takes full advantage of the Mobile Intel® QM87 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.
In system memory, support is provided for up to 2 16GB of DDR3L 1333/1600MHz low voltage memory interfaces for faster communication between components. The onboard memory storage, an optional SSD device, offers the persistent function of data storage.
The integrated 4th generation Intel® HD Graphics 4600 engine providing for smooth flash playback and rich 2D/3D graphics with high quality playback supports Intel® Clear Video Technology that supplies advanced imaging capabilities for Blu-Ray and other high-definition video processing such as image stabilization, gamut mapping and frame rate conversion. The enhancements in the instruction of Intel® Advanced Vector Extensions (Intel® AVX) 2.0 provide a significant performance improvement in integer and floating-point-intensive computations which are a key part of digital signal and image processing applications such as medical imaging and weather radar. Targeted at multimedia and medical applications, the HM960-QM87 brings additional features with Graphics APIs, including DirectX 11.1, OpenCL 1.2, and OpenGL 3.2, by supporting 3 display outputs in any combination of VGA, LVDS and DDI (HDMI, DVI, and DisplayPort) allowing you to choose the best combination to suit various applications requirements. VGA supported through the Mobile Intel® QM87 Express chipset displays with resolution up to 2048x1536, and LVDS displays 24-bit, dual channel up to 1920x1200.
In addition, the HM960-QM87 mobile platform offers a cost saving solution through better manageability and improved security with a new version of the Intel® vPro™ Technology (including Intel® Active Management Technology 9.0 and Intel® Trusted Execution Technology) which enables you to better manage and secure your computers with client isolation, network filtering, security agents and anti-virus protection.
The HM960-QM87 is also packed with high performance and flexible I/O with the Mobile Intel® QM87 Express chipset. With 4 super speed USB 3.0 ports, this new mobile platform allows your system to process more data load and provide faster loading of frequently used applications. It also provides 8 USB 2.0 interfaces, High Definition Audio interface, 4-bit input and 4-bit output GPIO connector for device controls, 1 Intel® Gigabit LAN controller to increase transmission speed for network-intensive applications, and 4 Serial ATA 3.0 ports with speed up to 6Gb/s supporting RAID 0/1/5/10 for applications that need fast storage speed. The HM960-QM87 also comes with multiple expansion configurations, including 1 PCIe x16 interface for high performance graphics displays and 7 PCIe x1 interfaces, to offer additional capabilities for the various demands.
The HM960-QM87, a new mobile embedded module board with all these combined features as described above, is an ideal product for a whole range of applications requiring a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, and KIOSK embedded applications.
HM960- QM87 Features:
• COM Express Basic Module (95mm x 125mm)
• Supports 4th generation Intel® Core™ processors
• Mobile Intel® QM87 Express Chipset
• Supports 2 DDR3L 1333/1600MHz SODIMM up to 16GB system memory
• 1 VGA, 1 LVDS and 3 DDI interfaces support 3 display outputs
• 1 Intel® Gigabit LAN interface
• 4 USB 3.0 ports
• 8 USB 2.0 ports
• 4 SATA 3.0 ports with data transfer rate up to 6Gb/s
• 4-bit input and 4-bit output GPIO connector
• 1 PCIe x16 interface
• 7 PCIe x1 interfaces
• Intel® Active Management Technology (AMT) supports Intel® AMT 9.0
• SATA to SSD onboard – optional
• Trusted Platform Module (TPM) – optional
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an e-mail: inquiry@dfi.com
For more information on the HM960-QM87 COM Express Basic Module, please visit: www.dfi.com
About DFI
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
DFI Inc.
100, Huanhe St., Xizhi Dist.,
New Taipei City 22154, Taiwan (R.O.C.)
Tel: +886 (2) 2694-2986
Fax: +886 (2) 2694-5815
Sales E-Mail: inquiry@dfi.com
Website: https://www.dfi.com/