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About Press Room Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs
Product News

Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs|Press Room|DFI

Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs

2016/01/06 (UTC-6)
Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs

DFI (a leading provider offering a wide range of embedded  products for industrial applications) announced four new embedded boards today, and it includes: two Mini-ITX motherboards, one single board computer (SBC), and one 2.5” Pico-ITX powered by the latest Intel® Pentium®/Celeron® processor N3000 family. Based on this new low power platform, designed for mid to entry level systems, these boards deliver enhanced graphics capabilities and premium performance averaging just 6 watts TDP. That makes these boards the ideal solution for a whole range of fanless and energy-saving embedded applications such as industrial automation, retail industries, and healthcare.

Low-Profile Mini-ITX Boards for Overall Retail Systems

DFI’s BW171 and BW173 Mini-ITX motherboards are designed with only 25mm in height and include a variety of I/O connectivity. In addition, the optional power connectors (including right angle connector, vertical type connector, and DC-in jack) are available for customers to easily assemble their all-in-one thin systems. The two thin Mini-ITX also support three independent displays, VGA+LVDS+DP++, with Intel® HD graphics to deliver up to 3840x2160 high resolution. Thanks to the above features, BW171 and BW173 are suitable for universal retail applications as digital signage, vending machines, and small POS systems


Small Form Factor Boards Designed for Fanless Healthcare

The BW051 is the all new Pico-ITX form factor measuring at 100mm x 72mm with DFI’s SBC platform design, and it features a small-sized mainboard to easily integrate into various space-limited applications with substantial I/O requirements. Additionally, DFI’s new embedded SBC boards, BW551 and BW051, are equipped with proprietary optional heat spreader with low thermal dissipation to satisfy fanless and mobile system integrations. These embedded boards also offer flexibility with multiple expansion interfaces: PCIe x1 slot, mSATA slot, Mini PCIe slot, and SIM card socket to expand and fulfill diversified computing applications such as: portable medical devices and fanless healthcare panel PCs.


DFI’s embedded boards are specially designed by industrial-grade components with 100% Japanese CAP and polymer capacitors to ensure long product lifecycle and MTBF. Furthermore, the 15k high ESD protection on all I/O ports prevents any damages to the internal components from static electricity and ensures system’s robustness in harsh environments. DFI also provides a high-qualified testing environment in thermal cycle testing, thermal profile temperature, and capacitor temperature for all heat-generated parts. With these rich features, the four new board-level products comprehensively satisfy most of the embedded smart solutions.



About DFI

Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 34 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.


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