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AL700

System-On-Modules Qseven AL700
  • Intel Atom® E3900 Series
  • Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
  • Multiple expansions: 4 PCIe x1
  • 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI
  • 4GB/8GB DDR3L Dual Channel Memory Down
  • 15-Year CPU Life Cycle Support

Status : Launched

Low Power Consumption
Wide-temp: -40°C~85°C
Fanless Design
Compact Size
4K2K Display
Product Comparison
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RoHS Certification
CE Certification
FCC Certification
Qseven, AL700
Qseven, AL700
Qseven, AL700
System
Processor
Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory
4GB/8GB DDR3L Memory Down
Dual Channel DDR3L 1600MHz
BIOS
AMI SPI 128Mbit (supports UEFI boot only)
Graphics
Controller
Intel® HD Graphics Gen9LP Series
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DVI/DP++)
1 x LVDS/(eDP+DDI) (DDI available upon request)
LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 3840x2160 @ 30 Hz
DP++: resolution up to 4096x2160@60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Displays/ Triple Displays
LVDS + DDI (Dual)
eDP + DDI (Dual)
eDP+2DDI (Triple) (available upon request)
Expansion
Interface
4 x PCIe x1 (Gen 2)
1 x SDIO (with LED)
1 x LPC
1 x I2C
1 x SMBus
1 x SPI
1 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I211AT (10/100/1000Mbps) (0~60°C)
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)
I/O
USB
1 x USB 3.0 + 8 x USB 2.0
3 x USB 3.0 + 4 x USB 2.0 (option)
SATA
2 x SATA 3.0 (up to 6Gb/s)
eMMC
Supports up to 32GB eMMC
eMMC 5.0, BGA-153 Ball 8~32G (MLC mode)
GPIO
1 x 4-bit GPIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
FTPM
Enables or Disables the BIOS support for the security device
Power
Type
5V, 5VSB, VCC_RTC
Consumption
Typical: E3940: 12V @ 0.53A (6.36W)
Max.: E3940: 12V @ 1.78A (21.36W)
OS Support
OS Support (UEFI Only)
Windows 10 IoT Enterprise 64-bit
Ubuntu 15.10 (Intel graphic driver available)
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
1,020,531 hrs @ 25°C; 583,481 hrs @ 45°C; 364,855 hrs @ 60°C
Calculation model: Telcordia Issue 2
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Qseven form factor 70mm (2.76") x 70mm (2.76")
Compliance
Qseven specification revision 2.1
Standards and Certifications
Certifications
CE, FCC Class B, RoHS
Packing List
Packing List
1 AL700 board
1 Heat sink: TBD
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    AL700-B40-E50
    Part Number :
    770-AL7001-100G
    Description :
    Fanless, Intel Atom x5-E3950, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , 0 to 60°C
  • Model Name :
    AL700-T40-E30
    Part Number :
    770-AL7001-600G
    Description :
    Fanless, Intel Atom x5-E3930, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , -40 to 85°C
  • Model Name :
    AL700-T40-E40
    Part Number :
    770-AL7001-500G
    Description :
    Fanless, Intel Atom x5-E3940, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , -40 to 85°C

* N4200 and N3350 are supported upon request with MOQ requirement.

Optional Items
  • Item Name Part Number Description
  • Item Name :
    Bulk Box
    Part Number :
    TBD
    Description :
  • Item Name :
    Heat spreader
    Part Number :
    TBD
    Description :
  • Item Name :
    Qseven Carrier Board Q7X-151
    Part Number :
    770-Q7X153-000G
    Description :
  • Item Name :
    Bracket
    Part Number :
    A31-028001-200G
    Description :

Rugged Design and Energy-Efficiency for Deeply Embedded Applications

DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.

Wide Operating Temperature with Fanless Design

These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.

Energy Saving but High Performance

With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.

Experience Clarity with 4K UHD High-Resolution

The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for medical and multimedia solution.

Multiple Storage Choice: eMMC, SSD/ M.2 Module

As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB. Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice for automation, storage and design of IoT appliances.

Complete Product Line

Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1.

Endless IoT Possibilities with Windows 10 Compatibility

Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution.