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CS350-Q370

Industrial Motherboards microATX CS350-Q370
  • 8th/9th Gen Intel® Core™ with Intel® Q370
  • Rich I/O: 2 Intel GbE, 4 COM, 2 USB 3.1 Gen 2, 4 USB 3.1 Gen 1, 6 USB 2.0
  • 4 DDR4 DIMM up to 128GB
  • Three display ports: DVI-D, DP++, HDMI 1.4b supports triple independent displays
  • DP++ resolution up to 4096x2160 @ 60Hz, DVI-D resolution up to 1920x1200 @ 60Hz, HDMI 1.4b resolution up to 4096x2160@ 24Hz
  • Multiple expansion: 2 PCIe x16 (1 x16 or 2 x8 signal), 2 PCIe x4, 1 1 M.2 E key, 1 M.2 M key (support Optane Memory)
  • 15-Year CPU Life Cycle Support Until Q2' 33 (Based on Intel IOTG Roadmap)

Status : Launched

4K2K Display
DVI-D
DP
DDR4
Triple Independent Display
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RoHS Certification
CE Certification
FCC Certification
CS350-Q370
CS350-Q370
CS350-Q370
System
Processor
8th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors:
Intel® Core™ i7-8700K (6 Cores, 12M Cache, up to 4.7 GHz); 95W (Non-LTS)
Intel® Core™ i7-8700 (6 Cores, 12M Cache, up to 4.6 GHz); 65W
Intel® Core™ i7-8700T (6 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Core™ i5-8500 (6 Cores, 9M Cache, up to 4.1 GHz); 65W
Intel® Core™ i5-8500T (6 Cores, 9M Cache, up to 3.5 GHz); 35W
Intel® Core™ i3-8100 (4 Cores, 6M Cache, 3.6 GHz); 65W
Intel® Core™ i3-8100T (4 Cores, 6M Cache, to 3.1 GHz); 35W
Intel® Pentium® G5400 (2 Cores, 4M Cache, 3.7 GHz); 58W
Intel® Pentium® G5400T (2 Cores, 4M Cache, 3.1 GHz); 35W
Intel® Celeron® G4900 (2 Cores, 2M Cache, 3.1 GHz); 54W
Intel® Celeron® G4900T (2 Cores, 2M Cache, 2.9 GHz); 35W
9th Generation Intel® Core™ LGA 1151 Socket Processors:
Intel® Core™ i9-9900K (8 Cores, 16M Cache, up to 5.0 GHz); 95W (Non-LTS)
Intel® Core™ i7-9700K (8 Cores, 12M Cache, up to 4.9 GHz); 95W (Non-LTS)
Intel® Core™ i7-9700E (8 Cores, 12M Cache, up to 4.4 GHz); 65W
Intel® Core™ i7-9700TE (8 Cores, 12M Cache, up to 3.8 GHz); 35W
Intel® Core™ i5-9500E (6 Cores, 9M Cache, up to 4.2 GHz); 65W
Intel® Core™ i5-9500TE (6 Cores, 9M Cache, up to 3.6 GHz); 35W
Intel® Core™ i3-9100E (4 Cores, 6M Cache, 3.7 GHz); 65W
Intel® Core™ i3-9100TE (4 Cores, 6M Cache, to 3.2 GHz); 35W
Chipset
Intel® Q370 Chipset
Memory
Four 288-pin DIMM up to 128GB
Dual Channel DDR4 2400/2666 MHz (non ECC support)
BIOS
AMI SPI 128Mbit
Graphics
Controller
Intel® HD Gen 9 Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
1 x DP++, DP++: resolution up to 4096x2106 @ 60Hz
1 x HDMI 1.4b: resolution up to 4096x2160@ 24Hz
1 x DVI-I (DVI-D signal), DVI-D: resolution up to 1920x1200 @ 60Hz
Triple Displays
DVI-D + DP++ + HDMI 1.4b
Expansion
Interface
2 x PCIe x16 (Gen 3) (1 x16 signals or 2 x8 signals)
2 x PCIe x4 (Gen 3)
1 x M.2 2230 E key (PCIe x1/USB2.0/intel CNVi support)
1 x M.2 2242/2260/2280 M key (PCIe Gen3 x 4 NVMe)
Audio
Audio Codec
Realtek ALC888
Ethernet
Controller
1 x Intel® i219LM PCIe (10/100/1000Mbps) with iAMT 12.0 (only Core i7/i5 supports iAMT)
1 x Intel® i211AT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
Serial
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
PS/2 1 x PS/2 (mini-DIN-6)
USB
2 x USB 3.1 Gen 2
2 x USB 3.1 Gen 1
2 x USB 2.0
Display
1 x DVI-I (DVI-D signal)
1 x DP++
1 x HDMI 1.4b
Audio
1 x Line-out
1 x Line-in (colay, opt. by request, MOQ required)
1 x Mic-in
Internal I/O
Serial
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
2 x RS-232
USB
2 x USB 3.1 Gen 2
4 x USB 2.0 (2.54mm pitch) (1 x USB 2.0 colay vertical Type A) (opt. by request, MOQ required)
Audio
1 x S/PDIF, 1 x Front Audio Header
SATA
6 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
Output & Interval System Reset, Programmable via Software from 1 to 255 sec/min
Security
TPM
Infineon TPM 2.0 (Available Upon Request, MOQ required)
Power
Type
ATX
Connector
8-pin ATX 12V power
24-pin ATX power
Consumption
Typical: i7-8700K: 3.3V @ 0.16A (0.53Watt); 5V @ 0.44A (2.2Watt); 12V @ 0.55A (6.6Watt)
Max.: i7-8700K:3.3V @ 0.35A (1.16Watt); 5V @ 1.34A (6.7Watt); 12V @ 12.54A (150.48Watt)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 18.04
Environment
Temperature
Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
Humidity
Operating: 5 to 90% RH Storage: 5 to 90% RH
MTBF
548,936 hrs @ 25°C; 308,161 hrs @ 45°C ; 191,020 hrs @ 60°C ; 162,350 hrs @ 65°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
microATX form factor
244mm (9.6") x 244mm (9.6")
Height
PCB: 1.6mm
Top Side: 31.51mm
Bottom Side: 4.4mm
Packing List
Packing List
CS350-Q370 motherboard
1 COM port cable (W/Bracket, Length: 300mm, 2 x COM ports): A81-015026-023G
1 Serial ATA data cable (W/LOCK, Length: 500mm): 332-553001-005G
1 I/O shield: A49-CS3501-000G
M.2 Standoff: A33-725019-090G
M.2 Screw: A32-112016-041G
Country of Origin
Country of Origin
Taiwan (TAA Compliant Country)
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    CS350-Q370NRM
    Part Number :
    770-CS3501-100G
    Description :
    4 DIMM, 2 GbE, 4 COM, 4 USB 3.1 Gen 2, 2 USB 3.1 Gen 1, 6 USB 2.0, 24-pin ATX/8-pin ATX 12V, Thermal Active, -5 to 65°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    USB 2.0 port cable
    Part Number :
    A81-001066-016G
    Description :
    Length: 350mm
  • Item Name :
    USB3.1 Gen2 port cable
    Part Number :
    A81-001075-017G
    Description :
    Length: 300mm
  • Item Name :
    COM port cable
    Part Number :
    A81-015026-023G
    Description :
    Length: 300mm, 2 x COM ports
  • Item Name :
    Serial ATA data cable
    Part Number :
    332-553001-005G
    Description :
    Length: 500mm, W/LOCK
  • Item Name :
    Thermal solution
    Part Number :
    A71-101107-000G
    552-200049-000G
    761-103001-000G
    Description :
    For 35W, Height: 37.3mm
    For 65W, Height: 72.8mm
    For 95W, Height: 69.3mm
  • Item Name :
    DP to HDMI Dongle
    Part Number :
    612-D2H13M-000G
    Description :

Based on 8th Gen Intel® Core™ Processors

DFI’s brand new board series with 8th Generation Intel® Core™ processors are ideally designed for what’s coming in the new era. We have a full form factor lineup from Mini-ITX, micro-ATX, ATX, to SOM integrated with better CPU performance support with up to 6 processor cores increasing 10% performance than previous generation even when multitasking.

Complete Product Line

DFI offers a complete product series from different form factor motherboards like ATX, microATX, Mini-ITX, and system-on-modules based on 8th Generation Intel® Core™ Processor Family with high-performance design. It is able to be perfectly fitted into different applications.

Optimized Productivity & Responsiveness

DFI’s product series are supported with Intel® Optane™ memory to accelerate computer’s responsiveness to multitask workloads without wasting too much time. Additionally, our products support with 64 GB DDR4 RAM memory up to 2666 MHz to enhance better memory bandwidth and memory transfer speeds. DFI’s motherboard comes with an M.2 (2280) to support NVMe drives with write speeds up to 3500MB/s which are 7 times over SATA SSDs.

Improved and Multiple I/O Options

Our product series with 8th gen processors adopt the newest technology USB Type-C and USB 3.1 Gen2 to benefit data transfer rates of up to 10 Gbps. It’s two times faster than USB 3.0. Furthermore, our ATX motherboard series come with Intel Q370 chipset and 24 PCIe lanes, which have 4 more PCIe lanes than the Intel Q170 chipset motherboard. This enables rich I/Os and multiple expansions, making it an ideal solution for machine vision and industrial automation application.

Fantastic Visual Performance

DFI’s completed product series with Intel 8th gen processors have the capability of delivering advanced 4K video experiences supported with resolution higher than 1080p and high quality UHD streaming media for applications such as digital signage, digital security, and surveillance.

Enhanced Security Protection

For defending equipment from external threats of security awareness, DFI’s motherboards are available with the advanced feature of iAMT 12.0 for remote management and repair of systems. Aside from iAMT 12.0, DFI’s motherboards are supported with TPM 2.0 for protecting confidential data and improving system integrations.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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